five nodes in four years, something that no other company has achieved in years. Intel's own roadmap states that it aims to achieve "process leadership" in 2025. Process leadership, by Intel's standards, is the highest performance per watt. What does the journey to the best CPU look ...
CEO Pat Gelsinger earlier this year stated that Intel would be returning to product leadership in 2025, but hasn’t yet explained how this is coming about – that is until today, where Intel has disclosed its roadmap for its next five generations of...
除了全新的架构路线图之外,英特尔宣布对 Foveros 芯片堆栈封装技术进行了两项重大更新,并且第二代技术将于 2023 年的英特尔 4 Meteor Lake 处理器中首次亮相。 Foveros 芯片堆栈可以将数种硬件元素集成到单个芯片中,例如英特尔 Lakefield 芯片将 5 个 CPU 核心、1 个集成 GPU 和 DRAM 堆叠在了一个紧凑的堆栈中。...
Intel Process Roadmap As for products based on the Intel 20A process node, don't expect them to be a reality prior to 2025. Also, based upon the older roadmaps and where 20A is positioned, it looks to be either a rename of Intel's 5nm or 3nm process node. but more scaled up to ...
Intel Roadmap 2023 Intel CPU Black Friday & Cyber Monday Deals & Sales AMD Roadmap 2023 AMD CPU Black Friday & Cyber Monday Deals & Sales QuestionsIntel Core i9-14900KS Released, US Price for $729 ! Intel has once again pushed the boundaries of desktop processor performance by unveiling...
In addition to its graphics update, Intel also announced its new client and server CPU roadmap which encompasses its Core and Xeon chips.
Intel处理器的Roadmap更新了: 1.今年桌面级更新到Raptor Lake,和之前说的一样8+16,兼容LGA1700。 2、明年Metor Lake,计算核心采用Intel 4工艺,其它台积电,不确定这个是不是仅移动端。 3、再往后的Arrow Lake,跳过Intel 3,应该是CPU用Intel 20A,Intel 3只在Xeon上。
CPU Roadmap: Emerald Rapids and Granite Rapids Xeons 正在开发中 如前所述，英特尔今天并没有宣布他们HPC组合的任何部分的新芯片。因此，英特尔最新的HPC路线图基本上是他们最新的数据中心路线图的浓缩版，该路线图是在3月底首次向投资者公布的。毕竟，HPC是数据中心市场的一个子集，所以HPC路线图反映了这一点。...
Intel's process roadmap to 2025: Intel 7, 4, 3, 20A, and 18A explained Intel has outlined its new processes for the next few years, but what does it all mean? What else can you expect from Panther Lake? While Intel hasn't said much about the performance of Panther Lake overall,...
将于明年首次大规模生产的 Clearwater Forest,提供了未来 CPU 和 AI 芯片的设计蓝图,结合了 RibbonFET 全环绕栅极晶体管、PowerVia 背面供电和 Foveros Direct 3D 先进封装技术的高性能解决方案,以实现更高密度和功率处理能力。Clearwater Forest 也将是采用 Intel 3-T base-die 技术的首款产品。依托英特尔代工的...