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Zhang J. Modeling of thermally induced stresses in three-dimensional bonded integrated circuit wafers. J Electron Mater 2011;40:670-3.Zhang, J. ( 2010 ), “ Modeling of thermally induced stresses in three-dimensional bonded integrated circuit wafers ”, Journal of Electronic Materials, Vol. 40 ...
– Thermal Shutdown Circuit IRIS-G6653 D S GND Vin OCP/FB O.V.P. + - + - START LATCH REG. T.S.D Vth(1) Vth(2) DRIVE O.S.C D 2 S OCP/FB GND 1 5 3 4Vin IRIS类似零件编号 - IRIS-G6653 制造商 部件名 数据表 功能描述 International Rectifier IRIS-G6651 272Kb / 7P IRIS...
(La.OFF) Latch circuit release voltage *8 6.6 - 8.4 V Vin=24.5→6.6V Tj(TSD) Thermal shutdown operating temperature 140 - - ℃ - µA Latch circuit sustaining current *8 Definition Symbol Vin=24.5→8.5V Ratings Units Test Conditions - - 400 Electrical Characteristics (for MOSFET) (Ta=...
NASA-HDBK-4011, VERY HIGH-SPEED INTEGRATED CIRCUIT (VHSIC) HARDWARE DESCRIPTION LANGUAGEdoi:NASA NASA-HDBK-4011忙碌的范围:本美国宇航局技术手册的目的是帮助设计工程师使用良好实践,以产生高质量的设计,最大限度地减少错误,并产生可维护和可审查的描述.本手册介绍了一种称为超高速集成电路(VHSIC)硬件描述语言(...
Chen;G;Y;Jensen;B;Stolojan;V.Growth of carbon nanotubes at temperatures compatible with integrated circuit technologies.0.280-285G. Y. Chen , B. Jensen , V. Stolojan and S. R. P. Silva, "Growth of carbon nanotubes at temperatures compatible with integrated circuit technologies", Carbon , ...
66Kb/6PINTEGRATED SWITCHER IRISG5624A 271Kb/7PINTEGRATED SWITCHER IRIS-G6623 280Kb/7PINTEGRATED SWITCHER IRIS4015 63Kb/6PINTEGRATED SWITCHER IRIS-W6753 241Kb/8PINTEGRATED SWITCHER IRIS4011 62Kb/6PINTEGRATED SWITCHER Html Pages 1234567 数据表 下载...
www.irf.com6Pin No.SymbolDescriptionFunction1SSource PinMOSFET source 数据表 search, datasheets, 电子元件和半导体, 集成电路, 二极管, 三端双向可控硅 和其他半导体的