Atotech InPro® THF / InPro® THF2 ➤ Pattern via filling in VCP using insoluble anodes ✓ Unique high current density & OEM approved ✓ Find out more now!
BMV filling for IC-Substrates in VCL using insoluble anodes SAP pattern BMV filling Rectangular pattern track profile and excellent within-unit distribution For fine lines Process suited for next generation production with low surface plated copper and minimum dimple ...
Bhd.1182, Lorong Perindustrian Bukit Minyak 22Taman Perindustrian Bukit Minyak14100 Simpang AmpatPulau Pinang Malaysia Tel.: +60 4 506 9800Fax.: +60 4 506 2280 Email: Atotech.PNNG-customerservice@atotech.com Malaysia Selangor Sales office Atotech Malaysia Sdn. Bhd.Lot 6.03A, Level 6, 1 Tech...