在计算机术语中，"RIMM"是一个常见的缩写，全称为 "RAMBUS In-line Memory Module"，中文直译为 "Rambus在线存储器模块"。这个缩写在英文中的流行度为5535，主要应用于Computing领域，特别是在网络安全方面。RIMM代表的是一个在线存储解决方案，用于扩展计算机的内存容量，通过Rambus技术实现高速数据传输。RIM...
答案解析: A. DIMM(Dual In-line Memory Module):这是目前主流的内存插槽类型,主要用于台式计算机主板。DIMM插槽具有64位或128位的数据总线宽度,能够支持更高的内存频率和容量。在台式计算机中, DIMM插槽的尺寸通常较大,便于散热。 B. SIMM(Single In-line Memory Module):SIMM插槽在早期的台式计算机中曾经使用过,...
what is a load-reduced dual in-line memory module (lrdimm)? lrdimm is a type of memory module used in computer systems to increase the overall memory capacity and performance. lrdimms are designed to reduce the electrical load placed on the memory controller, allowing for larger memory ...
A full width single in-line memory module (SIMM) for dynamic random access memory (DRAM) memory expansions is disclosed. A printed circuit board having a multiplicity of DRAM memory elements mounted thereto is arranged in a data path having a width of 144 bits. The SIMM of the present ...
MCM(multi-chip module) 将多块半导体裸芯片组装在一块布线基板上的一种封装。根据基板材料可分为MCM-L,MCM-C 和MCM-D 三大类。 MCM-L 是使用通常的玻璃环氧树脂多层印刷基板的组件。布线密度不怎么高,成本较低。 MCM-C 是用厚膜技术形成多层布线,以陶瓷(氧化铝或玻璃陶瓷)作为基板的组件,与使用多层陶瓷基板...
HP LaserJet Enterprise M607, M608, M609, M610, M611, M612, M612; HP LaserJet Managed E60055, E60065, E60075, E60155, E60165, E60175 - Removal and replacement: Dual in-line memory module (DIMM) This document provides the procedures to remove and replace the DIMM. Mean time to repair:...
你好，这表示内存条规格是：DIMM DDR4规格，4GB容量，速度2400MHz，16位内存芯片×4，每个内存芯片8Gb，SODIMM（笔记本用）。容量是4GB。
(short for single in-line memory module) is a memory module consisting of six to nine RAM chips on a circuit board. There are two types of SIMMs - 30-pin modules, used inx86 machines, and 72-pin modules, used in 486 and Pentium systems. The memory chips on a SIMM module are ...
A SIMM, or single in-line memory module, typically has a 32-data-bit path to the computer that requires a 72-pin connector. For synchronous dynamic RAM (SDRAM) chips, which have a 64-data-bit connection to the computer, SIMMs must be installed in in-line pairs, since each one supports...
PURPOSE:To prevent the generation of a failure by adhering an external lead wire in parallel to the thickness direction of a distributing board. CONSTITUTION:The lead 5b of a semiconductor device 2b is electrically and mechanically connected onto the land part 6b of a distributing board 1b by ...