The invention discloses an IGBT (insulated gate bipolar translator) module packaging process and an IGBT module with bidirectional heat radiation, belonging to the technical field of semiconductor device manufacturing. The process comprises the following steps: step 1.1, implanting a metal ball (2) ...
Introduction of IGBT power module packaging process 生产流程 1. 丝网印刷 2. 自动贴片 3. 真空回流焊接 4. 超声波清洗 5. 缺陷检测(X光) 6. 自动引线键合 7. 激光打标 8. 壳体塑封 9. 壳体灌胶与固化 10. 端子成形 11. 功能测试 1、丝网印刷 目的: 将锡膏按设定图形印刷于DBC铜板表面,为自 动贴片...
individually designed power module is the path to achieve demanding cost and performance targets at system level. Also, it is through customization that the technologies truly come to their right. The award will pay off in cost-effectiveness on system level, especially for high-volume manufacturing...
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StarPower GD820HTX75P6H Tri-Pack IGBT Module ——逆向分析报告 来自斯达半导体的Tri-Pack功率模块采用直接液体冷却针翅结构 据麦姆斯咨询介绍,旨在降低平均二氧化碳排放量的新环境法规和其它汽车发展趋势有助于提高汽车电气化程度,加快电动汽车/混合动力汽车(EV/HEV)的销售。Yole预计,到2024年,电动汽车/混合动力汽车的...
IGBT module, overcurrent, overvoltage protection Overcurrent protection:Overcurrent protection for IGBTs by fuses is usually not possible. Protection has to be provided by the driver or the control unit. Severe overcurrent with short duration (short circuit) usually is detected immediately by the...
Fig.1 Schematic diagram of typical IGBT power module packaging 高压大功率IGBT模块对灌封胶的要求主要有:①灌封胶材料绝缘强度高,足以保障芯片终端钝化层及器件内部三结合点处等电场集中位置的绝缘;②灌封胶材料制备无副产物;③灌封胶材料具有一定的耐热、防水、耐机械性能等[17]。由于材料的制备工艺决定材料的性能...
In addition handling in mounting and maintenance can be improved. This reduces process time in manufacturing. Thermal interface material (TIM) is a key component in the majority of power electronic systems. Heat, generated by the semiconductors, has to be transferred to a heat sink and finally ...
3.5 Control of the Manufacturing Process Various measures have been taken to control the elements that have a decisive influence on the quality of the product. Measuring instruments are used to monitor water purity, atmospheric conditions, furnace temperatures, gas flow, and other factors. Check-...
Fig.3 The CFD model of the IGBT module 表2 CFD仿真模型中材料热参数 Tab.2 Material parameters in the CFD model 2 混合型3-D热阻模型 2.1 热阻模型拓扑 系统的可观性与物理对象的自身属性和传感器的部署位置有关。在IGBT模块内部,如与芯片电气隔离的铜层上、散热基板的上表面、散热基板底部区域布置温度传...