“T-CHMT”是一个广泛应用于学术领域的英文缩写，全称为“IEEE Transactions on Components, Hybrids, and Manufacturing Technology”，中文直译为“IEEE组件、混合动力和制造技术汇刊”。这个缩写词在科技文献中具有较高的识别度，主要用于描述与电子组件设计、混合系统开发以及制造业技术相关的学术期刊内容。
The IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, elect...
影响因子趋势图IEEE Transactions on ComponentsPackaging and ManufacturingTechnologyIEEE Transactions on Components Packaging and Manufacturing Technology2015年2016年2017年2018年2019年2020年2021年11.251.51.752期刊VIP(qikanvip.com) 返回列表 立即提交 * 请认真填写需求信息,我们会在24小时内与您取得联系。更多...
Technol. IEEE TRANSACTIONS ON COMMUNICATIONS COM IEEE Trans. Commun. COM* IEEE Trans. Commun. Technol.* (through 1971) IEEE COMMUNICATIONS LETTERS COMML IEEE Commun. Lett. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING IEEE Trans. Compon. Packag. Technol. TECHNOLOGY CAPT CPMTA* IEEE Trans. ...
aIEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrica...
投稿地址: 编辑部地址: 录用难度:容易 统计分析 影响因子:指该期刊近两年文献的平均被引用率,即该期刊前两年论文在评价当年每篇论文被引用的平均次数 Created with Highcharts 10.0.0年份IEEE Transactions on Components Packagingand Manufacturing Technology近年影响因子IEEE Transactions on Components Packaging and ...
IEEE Transactions on Components Packaging and Manufacturing Technology目前的主编是Ravi Mahajan。 近期想要快速发表文章的同学可以添加佩普科研助理咨询,佩普学术是专门为科研工作者投稿SCI快速发表服务的科研服务品牌,根据文章匹配3-5本非预警正刊录用方案,而且最快2个月接收,100%正刊录用,录用后无撤稿风险!
Communications, IEEE Transactions on IEEE Trans. Commun. IEEE Trans. Commun. Technol.* (until 1971) Components, Packaging and Manufacturing Technology, IEEE Transactions on IEEE Trans. Compon. Packag. Manuf. Technol. IEEE Trans. Compon. Packag. Technol.* (1999-2010) IEEE Trans. Compon., Packag...
《Ieee Transactions On Components Packaging And Manufacturing Technology》(《元件封装与制造技术IEEE Transactions》)是一本由Institute of Electrical and Electronics Engineers Inc.出版的ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC学术刊物,主要刊载ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ...