A cover letter stating explicitly that the manuscript is being submitted for publication in Electron Devices Letters must accompany the manuscript. Manuscripts must be uploaded to the EDL web site at http://mc.manuscriptcentral.com/edl. A user account is required to submit a manuscript. Before ...
IEEEELECTRONDEVICELETTERS,VOL.34,NO.8,AUGUST2013981AlGaN/GaNSchottkyBarrierDiodesonSiliconSubstratesWithSelectiveSiDiffusionforLowOnsetVoltageandHighReverseBlockingYi-WeiLian,Yu-SyuanLin,Jui-MingYang,Chih-HsuanCheng,andShawnS.H.HsuAbstract—Inthisletter,aselectiveSidiffusionapproachisproposedtoimproveboththeforward...
andMingLiuAbstract—Resistiveswitchingmemorywithlowswitchingcurrentiscriticalforlow-powerapplication.Inthisletter,wesuccessfullydemonstratedafour-terminalresistiveRAMdevicewithultra-lowswitchingcurrent.ThedeviceisSETbyonepairofelectrodesandRESETbytheother.Theruptureprocessofconductivefilamentcanberesultedfromelectrochemical...
IEEE Transactions on Electron Devices：大类二区，小类三区。器件类顶刊之一，但设计类工作也有涉及，...
The man-uscript must be accompanied by a cover letter stating explicitly that the man-uscript is being submitted for publication in ELECTRON DEVICE LETTERS. Themanuscript length must be less than 2200 words as computed using the fol-lowing algorithm. The words in five full lines of text are ...
IEEE Transactions on Electron Devices 1423 cites at Google Scholar DOI:10.1109/TED.2006.884077 5.Changsheng You,Kaibin Huang,Hyukjin ChaeandByoung-Hoon Ki Energy-Efficient Resource Allocation for Mobile-Edge Computation Offloading IEEE Transactions on Wireless Communications ...
IEEE TRANSACTIONS 一般的都不好中。。。如果楼主觉得自己的不错，完全可以试试啊。
[4] J. U. Duncombe, "Infrared navigation - Part I: An assessment of feasibility,"IEEE Trans. Electron. Devices, vol. ED-11, pp. 34-39, Jan. 1959. For an eJournal from an Online Database: [5] H. K. Edwards and V. Sridhar, "Analysis of software requirements engineering exercises ...
新的投稿系统上只有上传Cover letter/Comment的板块,但是这个部分写着only editor可见,这审稿人也看不见啊。其他的板块完全没有提交response的功能,只有最后一页有一个是否重新提交的选项。 編譯 9-11 0 #学术会议# 2024城乡规划、建筑学与园林景观设计国际会议 国际会议 2024城乡规划、建筑学与园林景观设计...
国际简称:IEEE J ELECTRON DEVI 年发文量:110 官网:http://eds.ieee.org/journal-of-the-electron-devices-society.html 2影响因子 工程:电子与电气小学科 2024年SCI期刊影响因子出炉获取相关优质资源精准匹配期刊 期刊简介影响因子趋势图同领域期刊服务明细 ...