This method has been commercially exploited in fan-out wafer-level packaging concepts, including the wafer-level ball grid arrays developed by Infineon and there distributed chip packages developed by Freescale Semiconductor Inc, Austin, Texas, USA34. Other unconventional chip-to-chip inter- connection...
. Arlington, Texas, USA, 1980; pp. 227-291. 23. Embley TM, Stackebrandt E. The molecular phylogeny and systematics of actinomycetes. Annu Rev Microbiol. 1994; 48:257-289. 24. Goodfellow M, Manfio GP, Chun J. Towards a practical species concept for cultivable bacteria. In: Species: ...
infrared bolometer focal plane arrays122are implemented as SoC solutions based on monolithic MEMS and IC integration using MEMS-last processing via layer deposition and surface micromachining. One example are the digital micro-mirror arrays from Texas Instruments that are depicted inFigure 12f–h6,118....
This method has been commercially exploited in fan-out wafer-level packaging concepts, including the wafer-level ball grid arrays developed by Infineon and there distributed chip packages developed by Freescale Semiconductor Inc, Austin, Texas, USA34. Other unconventional chip-to-chip interconnection ...