适用于(设备) HPAE-PAD 耐压 4000 psi (275 bar) 溶剂相容性 pH 0 至 14,高达 90% 的常见 HPLC 溶剂 粒径 10 µm 固定相 CarboPac PA10 长度(公制) 50 mm 直径(公制) 4 mm 品牌 赛默飞Thermo 价格说明 价格:商品在爱采购的展示标价,具体的成交价格可能因商品参加活动等情况发生变化,...
20-TSSOP (0.173, 4.40mm Width) Exposed Pad Supplier Device Package 20-TSSOP-EP MP1010BEM-LF 相关特供产品 料号 描述 操作 MP1010BEM MPS, TSOP-20 对比 MP1006ES SOP-16 对比 MP10073ES SOP16 对比 MP1007ES SOP16 对比 MP1007ES-LF-Z SOP-16 对比 MP1009ES SOP-16 对比 评分...
This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is the equation for an ambient temperature T of 25°C, one can calculate the power dissipation of the device which in this case is...
Package / Case28-VFQFN Exposed Pad Power - Output10dBm Product StatusActive Data Rate (Max)20.48Mbps Voltage - Supply1.8V ~ 3.3V Serial InterfacesSPI RF Family/Standard- Current - Receiving8mA DigiKey ProgrammableNot Verified Operating Temperature-40°C ~ 85°C ...
1. FR−4 @ Minimum Pad. Semiconductor Components Industries, LLC, 2005 1 Publication Order Number: January, 2005 − Rev. 0 NSB1010XV5/D NSB1010XV5T5 ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) A Characteristic Symbol Min Typ Max Unit Q1 TRANSIS...
Microchip Technology AR1010-I/ML 型号: AR1010-I/ML 品牌: Microchip Technology 封装: 20-VFQFN Exposed Pad 描述: 库存: 2400 询价: 快速响应,快速报价 闪电发货,售后无忧 原创渠道,保证正品
ETC [ ETC ] Part Numbering Guide H H Pin 1 Connection Supply Voltage H = HCMOS *See page VA4 forTape Specifications Mechanical Dimensions 4 3 2 4 1 3 2 1 Pad Connections Suggested Solder Pad Layout Logic 0 or GND = High Impedance ...
qJA=90°C/W for 0.4" Sq pad qJA=70°C/W for 0.5" Sq pad qJA=55°C/W for 1" Sq pad ELECTRICAL SPECIFICATIONS Unless otherwise specified, these specifications apply over, Cin=1uF, Vin=5V,Cout=10uF, and Tj=0 to 125°C.Typical values refer to Tj=25°C. PARAMETER SYM TE...
型号: PPXN1010VLQ120R PDF下载: 下载PDF文件 查看货源 内容描述: PXD10微控制器 [PXD10 Microcontroller] 分类和应用: 微控制器 文件页数/大小: 130 页 / 717 K 品牌: FREESCALE [ Freescale ]Electrical characteristics Table 33. SMD pad electrical characteristics Value Typ Symbol C Parameter...
PAD连接 三态操作 逻辑1或NC =振荡 逻辑0或GND =高阻抗 建议焊盘布局 2脚:接地/外壳 PIN 3 :输出 P I N 4 :ü P P L 武升TA克é 2.0 .079 2.2 .087 环保/机械 标志 冲击: MIL - STD-883标准, 2002年的方法,条件B 可焊性: MIL -STD- 883 ,方法2003 耐溶剂性: MIL- STD- 202方法215 振...