In the past, IC design accounted for around 27% of the total IC market share in China, according to industry reports. The figure jumped to 40.5% in 2019, thanks to its fast growth rate, surpassing all other IC sectors. Moreover, the Chinese IC market size has doubled from RMB360.98 ...
Overcome the limitations of monolithic scaling with 3D IC design software. Explore advanced design and testing workflows to optimize chiplet performance.
2023 & 2024 Standard Logic IC market size report includes a forecast to 2030 and historical overview. Get a sample of this industry analysis as a free report PDF download.
High-speed PCB design and layout focuses EiceDRIVER™ isolated gate driver family overview Meet the EiceDRIVER™ 1200 V level-shift gate driver family A high-level introduction to gate drivers 零排放燃料电池电动汽车将融入未来的电气化生活方式 ...
Speed up your design cycle and reduce time to market with these simple to use building blocks. Galvanic isolated Gate Drivers with advanced Protection Features Share We use both our own and third-party cookies to enable the correct functioning of our services and, with your consent, to ...
ABB is partnering with PACCAR, a global leader in the design, manufacture, and customer support of high-quality premium trucks, to provide PACCAR dealers and their customers with a range of advanced charging solutions across its fleet operations in North America and Europe. In the United States ...
3D WLCSP has a simplified process design for manufacturing 3D ICs, which uses polymers that can sustain high temperatures, thus addressing the thermal issue, which is the major challenge for this market. 3D WLCSP has gained popularity in space-constrained consumer electronic applications and other ...
“mainstream” and step outside the IDM world unless 3D-ICs can be designed and produced in a cost-effective way, with sufficient turnaround time to meet market windows. This will be possible only with a robust and well-defined supply chain ecosystem, including semiconductor design companies, ...
Regardless of the chip type and size, the IC chip design and manufacturing process follows certain well-defined steps. The integrated circuit (IC) design and manufacturing process involves the design, fabrication, testing, and packaging of an IC. ...
Wafer Capacity by Feature Size Shows Strongest Growth at <10nm Nov. 18, 2020 DRAM Price Erosion Expected Through the End of 2020 Oct. 28, 2020 China Forecast to Represent 22% of the Foundry Market in 2020 Oct. 14, 2020 Two Acquisitions Make 2020 Second-Highest Year for Semi M&As ...