Amkor Technology, Inc. is one of the world’s largest providers of outsourced (OSAT) semiconductor packaging, design, and test services.
including those operating at ultra-low voltages down to 0.45V. However, mobile and IoT chip providers, in their continued drive to further reduce operating
Crosstalk noise is mainlygenerated by both inductive and capacitive coupling of the electromagnetic (EM)field. In the case of receivers, crosstalk noise behaves as wideband noise which cannotbe effectively compensated by equalization in a siliconchip. Moreover, high insertion loss associated with a hi...
Integrated circuit, an assembly of electronic components with miniature devices built up on a semiconductor substrate. The resulting circuit is thus a small monolithic ‘chip,’ which may be as small as a few square millimeters. The individual circuit co
·Decaps are on-chip decoupling capacitors (Extrinsic Capacitances) that are attached to the power mesh to decrease noise effects (dynamic I.R. Drop) ·Supply voltage variations caused by Instantaneous Voltage Drop (IVD) lead to problems related to spurious transitions and delay variations ...
Single Chip USB to Asynchronous Serial Data Transfer Interface, Auto Transmit Buffer Control Used for the Development of C8051F12x Microcontroller Unit Used for the Development of C8051F31x Microcontroller Unit Complete End to End Professional System, Most Vehicle Types Covered, Expandable Logic Analyze...
Chip-scale Packages (CSP): CSP is a miniaturized package type where the package size closely matches the size of the semiconductor die, resulting in a compact form factor. CSP offers advantages such as reduced footprint, improved electrical performance, and shorter signal paths. It finds applicati...
Full Site Search Silicon IP Verification IP Software IP News Industry ArticlesSynopsys IC Compiler II布线系统提供卓越的结果质量Graphcore Adopts IC Compiler II for Implementing their Machine-Learning Processor Chip MOUNTAIN VIEW, Calif. -- Feb. 21, 2017 -- Synopsys, Inc. (Nasdaq: SNPS) today annou...
Secure-IC’s secure element is an integrated security service platform to provide security from chip to edge and cloud, composed of 1) (ISE) Integrated secure element, 2)Associated service stack, (Firmware including secure connectivity libraries, 3) Server security lifecyles such as key management...
The family enables accurate power analysis for block-level and full-chip designs starting from RTL, through the different stages of implementation, and leading to power signoff StarRC. The EDA industry’s gold standard for parasitic extraction The figure below summarizes the elements of the platform...