Low-power IC (integrated circuit) design is a crucial aspect of modern electronics, as it allows for longer battery life and lower energy consumption in devices. The growing market for battery-powered devices has made it necessary for chip designers to strongly consider diff...
The present invention provides an improved method for integrated circuit design, by using a layout tool, synthesis, and analysis of the timing sequence in order to avoid premature optimization spend too much time and be stuck (Figure 2-13). 由于设计围绕于投片,一些问题必须同时收敛,以及一个有用...
本硕众所周知top3有五所里的一所 本科弱电硕士集电 三年IC公司实习 主业testchip设计 送审5个发明专利...
3D-IC技术是指用于多芯片集成电路的一系列封装技术,其中多个半导体芯片(称为“芯粒”)彼此靠近(2.5D-IC)或相互叠放(3D-IC)。这些芯粒(Chiplet)使用带硅通孔(TSV)的硅中介进行互连,这些通孔穿过硅中介并实现所有层之间的连接。TSV可提供更短的互连长度、更低的寄生电容和更高的带宽,从而提高系统性能。该技术,可...
MCU(Micro Controller Unit),又称单片微型计算机(Single Chip Microcomputer),简称单片机,是指伴随大规模集成电路的出现及其发展,将计算机的 CPU、RAM、ROM、定期数器和多种 I/O 接口集成在一片芯片上,形成芯片级的计算机。 MCU 的分类 MCU 按其存储器类型可分为 MASK(掩模)ROM、OTP(一次性可编程)ROM......
If the macro-level building blocks need to be modified to achieve the requirements of the IC, custom circuit design techniques are used. During this step, “how” the chip will be implemented begins to be defined. Physical Design. During this step, the actual layout of the interconnected ...
"Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications" Y. C. Lee, 2008, ISBN: 9780470055356 本书详细介绍了半导体器件封装技术,包括模拟和功率半导体应用的封装方案和设计策略。 半导体工艺中文书籍 《半导体器件工艺(第三版)》 李贵云,2006年,ISBN:9787122029502 该书系统介绍了半导体器件...
(QuadFlatPackage,QFP)等封装形式在其 发展上有所限制,20 世纪90 年代中期以球栅阵列封装(BallGridArray,BGA)、芯片级封装(Chip Scale Package,CSP)为代表的新型IC 封装形式问世,解 决了封装引脚共面度、脚距过细和面积过大等问题,随之也产生了一种半导体芯片封装的必要新载体, 这就是IC 封装基板(IC Package...
专题二:A/MS Design Solution (模拟和混合信号设计解决方案) 专题一涉及的技术内容: 1. Verification update-- Felix Cha 2. Low Power Techniques Introduction 3. Cadence Low Power Solution overview 4. Common Power Format 5. Low Power Architecture Design with InCyte Chip Estimator (ICE) 6. Low Po...
(such as a mode for a KGD test or a known good stack test). Conventional DFT architectural approaches and techniques such as on-chip compression, boundary scan, memory built-in self-test (MBIST), reduced pin count testing, and on-chip clocking for at-speed test are broadly applicable and...