GeForce RTX 2060 -- Intel Core i3-9100F -- The Witcher 3 Wild Hunt FPS Test - 761 -- 11:24 App AMD Ryzen 5 3600x + RTX 2060 1080p benchmarks! 781 3 3:31 App i3 9100F vs Ryzen 5 2600 vs Ryzen 5 1600 Benchmarks - 13 Tests 527 -- 3:00 App Need for Speed Payback ...
3D Graphics Performance ofIntel® Core™ i3-9100 CPU with UHD Graphics 630 Graphics Compute Info High-Level Tests Onscreen Offscreen 4K Aztec Ruins High Tier Offscreen N/A Aztec Ruins Normal Tier 1410 Frames (21.9 Fps) 1583 Frames
126 0 10:07 App i3 9100F vs. i9 9900K | Quad Core vs Octa Core CPU in 2020 94 0 10:11 App GTX 1660 Ti vs RTX 2060 Test in 8 Games 94 0 10:01 App GTX 1650 vs GTX 1660 Test in 9 Games 61 0 01:49 App GTX 1050 3GB vs GTX 1050 2GB Test in 7 Games 301 0 10:22 Ap...
先以3DMark PCI Express Feature Test功能来测试PCIe 4.0/3.0频宽。结果发现这部分，是采用5600XT拥有最高频宽(PCIe 4.0 x16模式)，再来是搭配GTX 1650 (PCIe 3.0 x16)的R3 3300X/3100、i5-9400F/i3-9100F，最后R5 3400G/R3 3200G，因为使用Vega内显，这部份的分数仅供参考。接着看3DMark的Time Spy...
这部分可以看到R3 3300X赢过i5-9400F,R3 3100赢过i3-9100F,至于Picasso家族在此就当作参考吧! 先以3DMark PCI Express Feature Test功能来测试PCIe 4.0/3.0频宽。结果发现这部分,是采用5600XT拥有最高频宽(PCIe 4.0 x16模式),再来是搭配GTX 1650 (PCI...
R15 1100. This CPU needs 120W PSU to perform AVX tortured test (otherwise it will automatically shutdown). All R0 CPUs require Intel ME 12.0.47.1524 to fix their 4K UHD BD playback issue. General information Vendor GenuineIntel Processor name (BIOS) Intel(R) Core(TM) i3-9100 CPU @ ...
16 Test 16 2019-03-04 20:21:0214:406514 所属专辑:初中英语星级训练听力 7年级 下载手机APP 7天免费畅听10万本会员专辑 激怒的老火 000
I have a new lga1151 board with an i3-9100 and a ddr4 memory with 4GB. When I power on the system, with a real 500w power source, the system (cooler)
R15 1100. This CPU needs 120W PSU to perform AVX tortured test (otherwise it will automatically shutdown). All R0 CPUs require Intel ME 12.0.47.1524 to fix their 4K UHD BD playback issue. General information Vendor GenuineIntel Processor name (BIOS) Intel(R) Core(TM) i3-9100F CPU @ ...
Test Setup » Under the hood of the Core i3-10100 is the 4-core "Comet Lake-S" silicon built on the same 14 nm++ process as the previous two generations. The die area is estimated to be 125 mm². This die looks similar to the 4-core "Kaby Lake" die. Certain steppings could...