This hybrid bonding technology is quickly becoming recognized as the preferred permanent bonding path to form high-density interconnects in heterogeneous integration applications, from 2D enhanced, to 3D stacking with or without TSVs, as well as MEMS. After entering the CMOS Image Sensor (CIS) ...
This review paper systematically analyzes the recent advancements in semiconductor packaging technology, focusing on hybrid bonding technology. Hybrid bonding is a crucial technique for enhancing integration density and thermal management in high-performance semiconductor devices by directly bonding metal to an...
First of all, the focus of this chapter is on silicon-to-siliconSilicon-to-silicon flip chip bonding and is not for silicon-to-organic substrate flip chip bonding as shown in Chaps. 2 , 3
1 Bonding Technologies Bonded magnets are generally prepared by blending coercive powder with a binder or by encapsulating coercive powder in a binder, followed by compacting or molding the material to the final shape. The powder of the magnetic materials used in bonded magnets may be ferrites, al...
This paper demonstrates a concept for a new additive manufacturing process for aluminium alloys, based on the Hybrid Metal Extrusion & Bonding (HYB) technology, along with the potential for further development of the process. The process is capable of producing near net shape structures at high de...
Human-machine interaction has emerged as a revolutionary and transformative technology, bridging the gap between human and machine. Gesture recognition, capitalizing on the inherent dexterity of human hands, plays a crucial role in human-machine interaction. However, existing systems often struggle to me...
A critical technology for composite piping systems in offshore platforms is the joining technique. This paper discusses the development of a hybrid joining approach by using heat-activated prepreg welding and adhesive bonding. The joining procedure was demonstrated via specimens' fabrication. Four ...
“metal/dielectric hybrid bonding”), which is a direct bonding technology (e.g., forming bonding between surfaces without using intermediate layers, such as solder or adhesives) and can obtain metal-metal bonding and dielectric-dielectric bonding simultaneously. In some embodiments, bonding interface...
A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. The first bonding struct
HYBRID BONDING STRUCTURE AND HYBRID BONDING METHOD 专利名称：HYBRID BONDING STRUCTURE AND HYBRID BONDING METHOD 发明人：HE, Ran,赫然,JIAO, Huifang,焦慧芳,DAI, Yufeng,代郁峰,YANG, Guanglin,杨广林,HO,Chihon,何志宏,XIE, Ronghua,谢荣华 申请号：CN2019/087006 申请日：20190515 公开号：WO2020/22796...