SMD Desoldering is generally done using a Hot Air Blower while Soldering can be done using a soldering iron and solder wire or using solder paste or solder balls (BGA) andSMD Hot Air Blower/ rework station. Ther
In electronics PCB Manufacturing, Assembly and Rework, the metals to be joined are the leads of the electronic components (thru-hole or SMD) with the copper tracks on the PCB. The alloy used to join these two metals is solder which is basically tin-lead (Sn-Pb) or tin-silver-copper (S...
1. Desoldering With A Soldering Iron Desoldering with a soldering iron is the easiest way to desolder your components. The only other tools you need besides the iron is a pair of pliers or tweezers. Below are the steps to consider: Heat the solder by using the sold...
Rework isn't the only thing a hot-air rework station is good for. Other uses include: Salvaging electronic components from old PCBs. Reflowing solder paste applied with a stencil between SMD components and a PCB. Shrinking heat-shrink to secure wire connections. Heating up and bending certain ...
Video: BGA DeSoldering & RemovalDemonstration With NASA Commentary:This short, helpful video demonstrates how to de-solder and remove Ball Grid Array devices in less than 5 minutes. It introduces the ZT-7000 Comprehensive BGA, SMD, QFN Hot Air Benchtop System. Thermal profiling and ramping is ta...
SMD componentssoldering steps: 1.Clean and fix PCB (printed circuit board) Before PCB soldering,check the PCB to be soldered to ensure that it is clean.The oily fingerprints and oxides on the surface should be removed so as not to affect the tin.When soldering the PCB by hand, if condi...
desoldered in order to remove it, and soldered back on when replacing. And since that process introduces air into the system, it has to be vacuum-pumped and charged with refrigerant after the repair, which requires specialty tools. This kind of repair you generally want to leave to a ...
Place the IC on the stencil and tightly hold it with the stencil using clip or tape. Now apply solder paste from the other side of the stencil. Solder paste will stick to the IC through the tiny holes in the stencil. Now apply hot air usingSMD rework station. This will solidify the ...
Baking may have adverse effects on the growth ofIMC, especially on boards with HASL (Hot Air Solder Leveling) and Im-Sn (immersion tin) surface finishes. These surface finishes create the copper-tin IMC layer during the PCB manufacturing process, before soldering takes place. Baking can cause ...
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