2) low melting point solder paste 低熔点型焊膏 3) mulls[mʌlz] (高熔点)膏药 4) spot welding nugget 点焊熔核 1. The infinite unit model ofspot welding nuggetthermal field is set up with 65 Mn steel. 在充分考虑接触电阻、液态熔核温度、相变潜热等因素对点焊熔核温度场影响的条件下 ,建立了...
Sn63pb37 High-Quality Solder Paste 500g Bottle Melting Point SMT Assembly Masterpiece, Find Details and Price about Solder Paste Welding from Sn63pb37 High-Quality Solder Paste 500g Bottle Melting Point SMT Assembly Masterpiece - DONG GUAN CITY YOSH...
Sn10pb88AG2 High Temperature Solder Paste Semiconductor Package with High Lead and Silver Content Applications: aerospace, aviation, silver-plated electronic components welding and other fields Product Specification Type Ingredient (WT%) Melting point(ºC...
25-48μm Model Number PPD Lead Free BGA Solder Paste Origin Mainland China Certification none Brand Name welsoloView more DescriptionReport Item Specifications: Material: Lead-free Solder Paste Melting Point: 138°C, 158°C, 183°C, 217°C Usage: BGA Rework Station Design: Low Medium High Te...
Specifications: Material: Lead-free Solder Paste Temperature Range: 138°C, 158°C, 183°C, 217°C Usage: Ideal for BGA, CPU, Rework Station, and Electronic Repair Design: Low Medium High Temperature Melting Point Options Performance: Enhanced Welding Flux for Precision Soldering Quantity: Availab...
Indium Corp., Utica, N.Y., has developed BiAgX high-melting-point lead-free solder paste for high-reliability electronics assembly. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor ...
Lead-free solder paste Sn99Ag0.3Cu0.7 183-248 Low cost, high melting point. Can be used for less demanding welding Sn96.5Ag3.0Cu0.5 183-258 High cost, good performance, suitable for high-demand welding Sn64.7Ag0.3Bi35 183-266 Good performance, low melting point, and finer ...
High-temperature lead-free solder paste is a lead-free solder paste with a minimum alloy melting point of 260°C, which is suitable for multiple reflow soldering of power semiconductor packaging and microelectronic packaging. Fitech adopts FH260 solder powder with excellent sphericity, uniform particle...
Lead-free solder pasteSn99Ag0.3Cu0.7183-248Low cost, high melting point. Can be used for less demanding welding Sn96.5Ag3.0Cu0.5183-258High cost, good performance, suitable for high-demand welding Sn64.7Ag0.3Bi35183-266Good performance, low melting point, and finer lattice alloys ...
Gold Tin Solder Pasteis used in a variety of high-reliability applications, where its high melting point, non-creep, high-tensile stress, thermal and electrical conductivity,as well as proven usage life makes it a standard “known-good” material. Gold tin solder paste properties Ultra-high rel...