This study focuses on surface modification of the core-shell Al nanoparticles with organic molecules that can provide not only the high dielectric strength but also improved dispersion and processibility in epoxy resins. We found that the epoxy nanocomposite filled with organic molecules-treated core-...
Dielectric strength was also evaluated according to ASTM-D149 after each 1000 h ageing. In the course of ageing time, neat epoxy was found with high dielectric loss and random rise in leakage current. In the case of both micro and nanocomposites, these properties indicated improvements over ...
Electric field built up between these two electrodes is homogeneous to a great extent.</B> ; <B>EFFECT: enhanced dielectric strength of switch; reduced probability of repeated initiation of electric-arc discharge.</B> ; <B>7 cl, 3 dwg</B> 展开 ...
2.Good dielectric strength 3.Excellent compatibility with insulating liquids (mineral oils, silicon oils and ascerol oils).3.Free from conductive particlesApplication:Crepe Paper is ideally suited to irregular shapes and surfaces where a proper insula...
thermal propertiesThe effects of nano゛luminum nitride (nano〢lN) on the thermal conductivity and dielectric performances of epoxy resin (EP) are investigated. The addition of nanoparticles in the materials is characterized. The trap characteristics of the samples are estimated using the surface ...
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Combination employment of high-molecular-weight and low-molecular-weight epoxy resins as matrices has been made. Heat-induced curing or crosslink of resin matrices has been carried out. Large band gap of silica filler has endowed the cured composite with high breakdown strength and ageing breakdown...
EPOXY EPOXY Resin Technical Date Pultrusion Profiles Performance Index Property TEST Method Units Mean-Value lw/cw Tensile Strength ASTM D638/GB1447--83 MAa 210/75 Tensile Modulus ASTM D638/GB1447--83 GPa 22/10 Flezural Strengh ASTM D790/GB...
Epoxy resin moulding compositions for sheathing semiconductor components which are inexpensive to produce and have good processing properties give, without addition of flameproofing agents, flame-resistant moulded materials of high glass transition temperature and low thermal expansion coefficient if they conta...