[单选] () pistons have low inertia and high coefficient of thermal expansion.A . Cast i
Further still, a spacer structure is disclosed that minimizes zero current shift.doi:US6791255 B1Timothy A. DerouinSudhakar GopalakrishnanUSUS6791255 * 2002年9月4日 2004年9月14日 Candescent Intellectual Property Services, Inc. High coefficient of thermal expansion spacer structure materials...
Engineering the coefficient of thermal expansion and thermal conductivity of polymers filled with high aspect ratio silica nanofibers 喜欢 0 阅读量: 42 作者:Rahmi,Ozisik,Shiva,Prasad,Kotha,Liyun,Ren,Hafez,Raeisi,Fard 摘要: Thehermomechanical propertiesf epoxyilled withwo differentypesfilica nanofillers...
The coefficient of thermal expansion (CTE) is a physical quantity that indicates the thermal expansion value of a material upon heating. For advanced thermal management, the accurate and immediate determination of the CTE of packaging materials is gaining importance because the demand for high-power ...
Metal matrix composites with high thermal conductivity and tailorable coefficient of thermal expansion are found widespread applications in electronic pack... WB Ren - 《Progress in Natural Science:Materials International》 被引量: 96发表: 2011年 Review of metal matrix composites with high thermal condu...
PURPOSE:To obtain a lightweight high conductivity material having low coefficient of thermal expansion and excellent in heat-resisting strength by subjecting Al containing AlN at a specific ratio as dispersion grains to mechanical alloying treatment. CONSTITUTION:This material is a high conductivity mater...
百度试题 题目Material with high bonding energy has low thermal expansion coefficient. A.正确 B.错误相关知识点: 试题来源: 解析 正确 反馈 收藏
A material with high bonding energy has low thermal expansion coefficient.A.正确B.错误
Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient... M Tsujioka,J Matsumura - US 被引量: 29发表: 1996年 Design and thermal shock performance of W/Cu functionally graded material used as plasma facing component The integrity of high sputtering ...
The material properties are listed in Table2. Density, elastic modulus, bending strength, fracture toughness, CTE (coefficient of thermal expansion), and thermal conductivity, were tested according to GB standard29,30,31,32,33,34. The joining process and microstructure of the blanks are shown in...