NVIDIA needs a lot of high-bandwidth memory chips, particularly HBM3Es, which are used for its current and next-generation AI chips. As one of the world's leading suppliers of AI chips, you can imagine that NVIDIA has considerable demand for HBM3E modules. SK Hynix has emerged as a ...
Explore how high-bandwidth memory (HBM) is pivotal to China's AI ambitions and the global semiconductor trade, with insights into the impact of U.S. trade restrictions and future market shifts.In our latest analysis, we explore the intersection of artificial intelligence (AI), advanced packaging...
Samsung Electronics has announced on its Newsroom webpage the development of a new kind of memory chip architecture called high-bandwidth memory, processing-in-memory—HBM-PIM. The architecture adds artificial intelligence processing to high-bandwidth memory chips. The new chips will be marketed as a...
HBM(High Bandwidth Memory,高带宽存储器)在封装过程中通常会使用underfill材料。Underfill是一种在半导体封装中用于加固和保护芯片的环氧树脂材料,它被应用在芯片和基板之间的空隙中,以提供机械支撑和热传导功能。 在HBM的封装中,underfill材料的使用尤为重要,因为HBM设计中包含了多层的垂直堆叠结构,这些结构在热循环和机...
HBM即高带宽内存(High Bandwidth Memory),是一种基于3D堆叠工艺的高性能DRAM内存芯片,有以下关键信息: • 高性能:有极高的数据传输速率,能达每秒几百GB,远超传统内存,可满足GPU等对带宽要求苛刻的芯片需求。 • 应用领域:主要用于高端显卡助力图形处理,也在高性能计算、人工智能加速卡领域广泛应用,提升数据密集型...
December 19, 2017 -- Intel today announced the availability of the Intel® Stratix® 10 MX FPGA, the industry’s first field programmable gate array (FPGA) with integrated High Bandwidth Memory DRAM (HBM2). By integrating the FPGA and the HBM2, Intel Stratix 10 MX FPGAs offer up to ...
for use in next-generation supercomputers, AI solutions and graphics systems Samsung Electronics, the world leader in advanced memory technology, today announced that it has started mass production of its 2nd-generation 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) with the fa...
Xilinx today unveiled details for new 16nm Virtex® UltraScale+™ FPGAs with HBM and CCIX technology. Containing the highest memory bandwidth available, these HBM-enabled FPGAs offer 20X higher memory bandwidth relative to a DDR4 DIMM and 4X less pow
for dedicated graphical memory increased, it cut the amount of power that could be delivered to the GPU, and card size continued to swell. GDDR5 wasn’t going to make the problem any better, so AMD set its sights on an entirely new technology, and decided it was high bandwidth memory. ...
一,科普HBM是High Bandwidth Memory的缩写,意思是高带宽内存。 它是一种新型的CPU/GPU内存芯片,将多个DRAM芯片堆叠在一起并与GPU封装在一起,实现大容量、高位宽的DDR组合阵列。HBM具有高速、高带宽的特性,适用于GPU显存和HPC高性能计算、AI计算等领域。相比传统的GDDR5等内存技术,HBM具有更高的传输速率和更低的功...