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The length of an object describes how long the object is and the height of the object states how tall the object is. For example, the length of the cuboid is different from its height unless it is not a cube. Q2 What is the difference between length and width?
as well as those in LSM5 and LSM7 protein–protein interaction subnetwork, implicated in splicing and mRNA decay in P-bodies33, for lumbar spine area and hip trochanter area association results, respectively (Supplementary Data7). DEPICT identified significant ...
The use of only dynamic deflection as the reference for the electric vehicle height adjustment will produce great errors. Therefore, this paper provides an observation algorithm, which can realize the accurate control of vehicle height. Firstly, the static equilibrium position equation of suspension is...
1. Introduction The structure of the fin field-effect transistor (FinFET) has completely emerged as a promising design solution for CMOS logic and memory circuit design because of its good immunity to short channel effects (SCEs) [1–3]. This technology enables the creation of high-performance...
For the conventional study on channel model, linear antenna arrays were employed in the horizontal direction [6–8]. This assumption is valid since the distance between the MS and the BS is much larger than the distance between the height of the BS antenna and the scatterers around the MS ...
The main reason for this phenomenon is that as the rear-wall height of the cavity decreases, the gas flows through the cavity into a larger flow channel, experiencing the process of expansion acceleration and intensifying the impact on the rear wall of the cavity combined with the reduced ...
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However, even if an IFRT is equipped with a sealing device on the annular-rim gap between the floating deck and the inner tank wall, the oil surface and the tank gas space cannot be completely isolated for the convenience of the floating deck moving up and down [1]. In addition, when ...
Introduction In the pursuit of higher operation speed and improved performance of microelectronic devices [1], the application of flip chip solder joints has become a key technology for high-density packaging. The solder joints have been used in high power devices, such as central processing unit ...