Rael, "Design optimization of a spreader heat sink for power electronics", Int. J. Thermal Sciences, Vol. 43, pp. 21-29, 2004.G. Maranzana, I. Perry, D. Maillet, and S. Rael, "Design optimization of a spreader heat sink for power electronics," Int. J. Thermal Sci., vol. 43, ...
design curves which may be used to rapidly explore a wide range of design options before selecting potential designs for more detailed evaluation using 3D FE analysis.In systems where the semiconductor devices are switching at high frequency the power dissipated, and therefore the heatsink weight, ...
The heat sink must protect the electronic equipment and components from overheating. Therefore, they must be made of certain materials with good thermal conductivity. Most devices that use power electronic equipment require a temperature-controlled environment. Otherwise, they are in danger...
Heatsink for power devices 优质文献 相似文献 参考文献 引证文献Thermal design, modeling and simulation of air forced cooling heat sink for Thyristor Controlled Reactor (TCR) Cooling is important for appropriate operation of the power electronic devices. In low power applications, the cooling is done ...
Power electronics include a printed circuit board on which at least one component to be cooled is mounted, and a heat sink which is arranged on that side of the printed circuit board which faces the component to be cooled. The heat sink is in thermally conductive contact with the component ...
Heatsinks are also widely used in LED lighting fixtures and power electronics applications, where effective thermal management is crucial for reliability and performance. In LED lighting fixtures, LEDs convert electrical energy into light, but a significant portion of that energy is also converted into...
散热器优化高功率电信冷却案例汇编heatpipedesign.pdf,Heat Sink Optimization High Power ecom Cooling Case John Thayer Thermacore International 780 Eden Road Lancaster, PA 17604-3234 : x208 John.Th Introduction Advances in semiconductor process technology en
This article is focused on the optimization and design of a multipass branching microchannel heat sink for high heat flux electronics cooling applications. A multiphysics topology optimization method is used to arrive at two different branching channel solutions for the cooling of a heated plate. These...
A power semiconductor module has a base plate with a heat sink affixed thereto, a housing affixed to the base plate, a DC busbar affixed to the base plate and to the housing, an AC
New fabrication technologies for the next generation of high-power devices were investigated. Techniques currently used for fabricating device/heat-sink assemblies are reviewed and critically assessed. The changes needed to increase the power ratings of devices are identified and discussed....