The first heat pipe (106) is disposed along a first line (118). The second heat pipe (108) is disposed along a second line (120) that is not parallel to the first line (118) and each of the first and second heat pipes (106, 108) includes a portion located beneath the ...
散热器优化高功率电信冷却案例汇编heatpipedesign.pdf,Heat Sink Optimization High Power ecom Cooling Case John Thayer Thermacore International 780 Eden Road Lancaster, PA 17604-3234 : x208 John.Th Introduction Advances in semiconductor process technology en
- Capillary Structure: The inner wall is coated with a capillary structure (such as metal mesh, slot structures, micro-channels, etc.) that helps the liquid phase of the working medium circulate within the pipe. The design of the capillary structure significantly affects the performance of the ...
[1] Garner, S.D., “Heat Pipes for Electronics Cooling Applications,”ElectronicsCooling, September 1996, https://electronics-cooling.com/1996/09/heat-pipes-for-electronics-cooling-applications/, accessed August 15, 2016. [2] Graebner, J.E., “Heat Pipe Fundamentals,” ElectronicsCooling,June ...
Heat Pipe Design Guide The focus of thisheat pipedesign guide is on sintered copper heat pipes (w/water) for electronics cooling applications. This typically translates to dissipated heat of between 20-200 watts (less if power density is high) and power density up to around 25 W/cm2....
Heat Pipe Design Guide The focus of thisheat pipedesign guide is on sintered copper heat pipes (w/water) for electronics cooling applications. This typically translates to dissipated heat of between 20-200 watts (less if power density is high) and power density up to around 25 W/cm2....
years, however, has the electronics industry embraced heat pipes asreliable, cost-effective solutions for high end cooling applications. Thepurpose of this article is to explain basic heat pipe operation, review key heatpipe design issues, and to discuss current heat pipe electronic cooling...
Once design is determined, estimate heat pipe performance. There are four power limits of interest: Capillary Limit- Wick can no longer transport liquid at a high enough flow rate to support evaporation rate. Affected by wick structure, fluid properties, and acceleration environment (most important...
Drawing on the structure of rotation heat pipe, one heat pipe cooling system, heat pipe grinding wheel (HPGW) applied to high-efficiency grinding, is developed and its heat transfer principle is illustrated. Besides, the cooling effect in the contact zone using HPGW is simulated through a ...
There is disclosed a planar heat pipe for cooling, which is embedded in a printed circuit board for cooling of heat-dissipating components (13). The planar heat pipe includes two panels (1, 2) that are both metal clad on one side (4, 5), at least one of the panels (1, 2) being...