LIQUID FILM FORMING COMPOSITION FOR MULCHING VINYL EQUIPPED WITH BIODEGRADATION PROPERTY, HEAT INSULATION PROPERTY AND PLANT GROWTH CONTROL FUNCTION AND A MANUFACTURING METHOD THEREOFPURPOSE: A liquid film forming composition for mulching vinyl is provided to be biodegradable after set time and control ...
A liquid polyurea resin mixture was obtained in the same manner as in Example 1 except that 150 parts of a polysiloxanediamine, which was similar to that used in Example 1 but had an average molecular weight of about 1,000, were added to a mixed organic solvent composed of 100 parts of...
The vinyl fluoride film 6 is coated with a high boiling point solvent, for instance, liquid methylated or dispersed in diethylenephthalate, and then heated to approximately 350 deg.C, dried, fixed and formed into the thickness of approximately 10-25mum. 展开 ...
This process was also applied to adhesive-free adhesion between a tetrafluoroethylene–perfluoroalkylvinylether copolymer (PFA) and PDMS; subsequently, a translucent PFA/PDMS assembly with strong adhesion was realized together with the PTFE/PDMS assembly. Strong adhesive-free adhesion between fluoropolymers...
or an organic group having a double or triple bond such as phenyl, carboxy, cyano or the like; vinyl esters or vinyl ethers, alkenyl-aromatic compounds such as styrene and substituted derivatives thereof; maleimides; mononitriles having alpha-beta-olefinic unsaturation and lower alkyl or halogen...
Katueangngan, K.; Tulyapitak, T.; Saetung, A.; Soontaranon, S.; Nithi-Uthai, N. Interfacial interactions of silica and natural rubber enhanced by hydroxyl telechelic natural rubber as interfacial modifier. J. Vinyl Addit. Technol. 2020, 26, 291–303. [Google Scholar] [CrossRef] Liu,...
[8,61] derived a special formula to describe the liquid water diffusivity in porous textiles. The condensation/evaporation, sorption/desorption, and liquid water transport by the capillary action were both considered in this equation. However, the transportation of the liquid water was also dependent...
A wire circuit pattern was scribed into the adhesive. After the wire scribed circuit pattern was formed, the adhesive was baked for one hour at 93.degree. C. to cure the adhesive. The bond strength of the wires to the adhesive was 20 N. ...
Vinyl based anhydrides, amides, maleimides and methylstyrenes have been explored as comonomers in different loading to enhance the heat resistance of polystyrene [4-5]. This is generally achieved by introducing heteroatom containing monomer in the polystyrene chain, which leads chemical irregularity ...
Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F Industrial Adhesives Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uni...