Liquid cooling is a method of heat dissipation based on chips and chip components. It mainly divides into direct and indirect cooling methods.The indirect liquid cooling method indirectly contacts the liquid coolant with the electronic components through theliquid cold plate, and transfers heat between...
PROBLEM TO BE SOLVED: To provide a heat dissipation sheet of electronic equipment in which the heat dissipation sheet is installed flat without warping even when, around an electronic component on which the heat dissipation sheet is provided, another electronic component taller than the electronic ...
which may be part of one of the heat conductive members, disposed in a movement path of the air to be discharged by the first heat dissipation fan to an outside of the wearable electronic device,wherein the wearable electronic device is configured so that heat generated from the first displa...
Heat dissipation is a critical bottleneck in a wide range of electronic devices including microprocessors, solar cells, laser diodes and radio frequency (RF) power amplifiers. Gallium nitride (GaN)-based power amplifiers have demonstrated unprecedented RF output power densities due to the excellent elec...
Cooling means within the opening of the electronic device is inserted in the chassis, when disassembly of the heat dissipation device, the operation of the clip so that the latching holes sprag departing from the chassis, the heat sink can be removed from the chassis of the electronic device ...
The 1060 aluminum sheet used in skived fin heat sinks is a high-quality material for heat dissipation, widely utilized in electronic devices. It boasts numerous advantages such as lightweight, fast heat dissipation, and corrosion resistance, making it an ideal choice in the manufacture of heat si...
A heat dissipation system and an electronic device. The heat dissipation system configured to circulate working fluid and to cool heat source. Heat dissipation system includes casing, first tube, second tube, condenser and flow rate controller. Partition
A heat dissipation assembly can be applied to the electronic device. By providing a heat dissipation fan and a temperature sensor for the heat dissipation assembly, and arranging th
Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second...
Thermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for ...