Download the HDI PCB Design Guide which provides tons of guidelines for blind and buried via technology.
This has resulted in designers utilizing smaller PCB boards to accommodate these design requirements, made possible through the use of High-Density Interconnect (HDI) PCB technology. HDI PCBs employ techniques such as blind vias, buried vias, micro vias, vias in pads, and very thin traces to ...
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Design practices for HDI PCB signal integrity The primary goal here is to equip you with practical tips and techniques to maintain optimal signal integrity in your high-density PCB layouts. From stack-up design tocontrolled impedance, we will explore various design strategies that can help you cre...
Learn about design basics for HDI PCB design. When planning for the HDI PCB manufacturing process, you can prepare accurate designs and deliverables with Altium Designer.
Impedance control is a vital consideration in HDI PCB design. Here are two impedance designs for a 4-layer 1.6mm-thick HDI PCB for reference. Impedance design 1 for 4-layer 1.6mm-thick HDI PCB (board thickness tolerance: +/-0.16mm) Layer Impedance properties Line width MIL Line spacing...
HDI PCB (1+N+1): Simplest HDI This structure of HDI PCB contains 1 “build-up” of high-density interconnection layers, suitable for BGA with lower I/O counts. It has fine lines, microvia and registration technologies capable of 0.4 mm ball pitch, excellent mounting stability and reliability...
In the PCB design world, HDI term means High-Density Interconnector. And this kind of PCBs is amongst the designs with fastest-growing which are surfacing. HDI PCB is a term for circuit boards which have a denser wiring per certain area, as a contrary with conventional board. The characteris...
HDI板设计过程
Speedflex HDI's end-to-end approach to stackup design allows you to create documents that can be shared at every stage of the PCB supply chain and drastically reduces the time you need to create, document and control PCB layer stackups. ...