The market is concerned that aggressive capacity expansion in TSV processes by some DRAM suppliers could lead to oversupply and price declines in 2025. Current plans to expand capacity reveal that Samsung is set to increase its TSV production from 120K wafers per month at the end of 2024 to 1...
Which means we’re looking at 480GB of LPDDR5X per Grace CPU, and 96GB of HBM3 per Hopper GPU. Or a total of 1920GB of LPDDR5X and 384GB of HBM3 memory. Jupiter Supercomputer: 24K GH200s at 18.2 Megawatts, Installing in 2024 Finally, NVIDIA is announcing a new supercomputer...
Growing demand for DDR5 and LPDDF5(X) to consume more advanced process capacity In addition to the increasing proportion of HBM demand, the growing content per unit in PCs, servers, and smartphones is driving up the consumption of advanced process capacity each quarter. Servers, in particular,...