PC: Windows 7 & 8, Vista, XP (SP2) - (32 & 64 Bit OS) 2Ghz AMD or Intel Pentium 3 compatible CPU with full SSE1 support 512Mb RAM. 30Mb free disc space. DirectSound or ASIO compatible soundcard. Mac: OSX v10.4 (Tiger)
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The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. Whereby, the polishing pad of present invention is capable to contain more grinding liquid, and is contributive to clean the ...
While good timing and precise control over drum strokes are essential skills for any drummer, robotic timing and overly consistent strokes can sound dull and lifeless like a badly programmed drum machine. Just what is it about the subtleties in someone like Jeff Porcaro’s playing that make his...
Download Steinberg Groove Agent SE Latest Version Free Click on the button given below to download Steinberg Groove Agent SE free setup. It is a complete offline setup of Steinberg Groove Agent SE for Windows and has excellent compatibility with x86 and x64 architectures. File Password:123...
A hollow groove, channel or other fillet is fitted in or on the frame to accept a solid or filled sleeve item such as bridgepiece, nose pad etc made of rubber, plastics, foam or other material. The channel or groove etc can be of optional shape and size depending on purpose....
A polishing pad () for polishing a wafer () or other article, the pad having a groove network () configured to vary the residence time across the wafer track of the reaction products formed by the interaction of reactants in the polishing medium () with structure on the wafer. The ...
A groove structure for avoiding stripping of a polishing surface of a polishing pad, the polishing pad including a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base ...
A chemical mechanical polishing (CMP) pad is provided. The CMP pad includes a groove pattern disposed on a polishing surface of the pad. The groove pattern is formed of an alternating sequence of spaced apart grooves. The alternating sequence of grooves comprises a groove of a first size and...
Muldowney G P.Polishing Pad Having a Groove Arrangement for Reducing Slurry Consumption[P].US Patent7125318,2006-10-24.US7125318 * Nov 13, 2003 Oct 24, 2006 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a groove arrangement for reducing slurry consumptionPolishing ...