In a VLSI layout design using the building block approach, the design is divided into two phases, placement and routing. On the other hand, a new hierarchical floorplanning method was proposed by Dai et al., in
这篇文章是他在密歇根大学当教授的时候发表的,他在UCLA读博期间的工作Capo也是VLSI CAD领域一个很重要的工作。 Historical development of global placement algorithms and implementations in academia. 正如文章Progress and Challenges in VLSI Placement Research所总结的, 二十一世纪第二个十年全局布局算法全面进入了基...
VLSI/ global routingcircuit layoutcircuit blocksNP-completeneural-computation-network architectureHopfield and Tank modelGlobal routing is a crucial step in circuit layout. Under the constraint of the relative positions of circuit blocks enforced by placement, the global routing develops an effective plan...
In: Proceedings of the IEEE/ACM International Conference on Computer-aided Design, pp 1–4 . IEEE Zhu W, Huang Z, Chen J, Chang Y-W (2018) Analytical solution of Poisson’s equation and its application to vlsi global placement. In: Proceedings of the International Conference on Computer-...
VLSI Physical Design: From Graph Partitioning to Timing Closure Andrew B. Kahng, Jens Lienig, Igor L. Markov & Jin Hu 5955 Accesses Abstract During global routing, pins with the same electric potential are connected using wire segments. Specifically, after placement (Chap. 4), the layout ...
5 Modular Placement for Interposer based Multi-FPGA Systems 来源:( P E ) 发表时间: 2016/01 类型:会议论文 为本人加分6 HS3-DPG: Hierarchical Simulation for 3-D P/G Network 来源:IEEE T VLSI SYST( P 1063-8210 E 1557-9999 ) 发表时间: 2015/10 类型:期刊论文 为本人加分...
HYBRID OF ANT COLONY OPTIMIZATION AND GENETIC ALGORITHM FOR SHORTEST PATH IN WIRELESS MESH NETWORKS S. Aravindh SIMULATED ANNEALING BASED PLACEMENT ALGORITHMS AND RESEARCH CHALLENGES : A SURVEY Rakesh Mohanty,Suchismita Pattanaik,Shubhendu Prakash Bhoi ...
The downward scaling of feature sizes in very large scale integration (VLSI) fabrication has resulted in the transition of the interconnect technology from Aluminum (Al) to Copper (Cu) for faster device performance. Owing to the differences between Al and Cu process, studies on the reliability pe...
20110127633Slotted Configuration for Optimized Placement of Micro-Components using Adhesive Bonding2011-06-02Nadeau257/506 20100140771Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant2010-06-10Huang et al. ...
[Nihon Gakkai Jimu Senta ASP-DAC\"95/CHDL\"95/VLSI\"95 with EDA Technofair - Chiba, Japan (29 Aug.-1 Sept. 1995)] Proceedings of ASP-DAC\"95/CHDL\"95/VLSI\"95 with EDA Technofair - Maple-opt: a simultaneous technology mapping, placement, and global routing ...