GATE Paper Code Qualifying Cut off Marks General OBC-NCL/ EWS SC/ ST/ PWD Physics 31.1 27.9 20.7 CE 26.6 23.9 17.7 Statistics 25 22.5 16.6 Electrical Engineering 25 22.5 16.6 XE 37.9 34.1 25.2 ECE 29.9 26.9 19.9 CH 32.10 – – Mechanical Engineering (ME) 28.4 25.5 18.9 CS 32.5 29.2 21....
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Therefore, compared with other models, the proposed method in this paper has higher prediction accuracy. Keywords: wind power system; junction temperature prediction; insulated-gate bipolar transistors; improved honey badger algorithm; extreme learning machine...
During the life cycle of an IGBT module, the bonding wires and the solder layers are prone to aging and fatigue due to the thermo-mechanical fatigue stress experienced by the packaging materials, e.g., mismatch in the coefficients of thermal expansion. The electrical overstress (EOS) (over...
(Invited) Combined Gas Cluster Ion Beam (GCIB) and Chemical-Mechanical Planarization (CMP) Process for Replacement Metal Gate (RMG) ApplicationThe introduction of high-metal gate (HK/MG) stack has enabled the resumption of Moore's Law at the 45/32nm nodes, when the conventional Poly/SiON ...
Cartridge filters are simple replace, will be just a question or replacing the filter much through the night would replace one from a wet-dry pressure. The paper-like filter gets dirty.you remove it.replace it and the done. I’d recommend the Waterway 50sqft Cartridge Filter System.If you...
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Details of the derivation of this analytical solution are provided in the Appendix A. 3.6. Inclusion Formation Model Using the calculated rate of air aspiration, the reaction rate of alumina inclusion formation, m A l 2 O 3 is estimated. The model assumes that the aspirated gas is air cont...
The changing in the resonant frequency is due to variations of the stiffness or mass of the mechanical structure. Resonant sensors have great potential for numerous applications such as ultrasound, medical, military and many others. This is due to the fact that they offer high accuracy, high ...
This paper investigates the failure of IGBTs during prolonged high-temperature operation, where internal bond wires lift off due to mechanical expansion, leading to module failure. Through theoretical analysis, it was identified that a significant alteration in the maximum gate charge current occurs whe...