Advanced Plasma Power (APP) has developed an advanced thermal conversion technology, (Gasplasma(R)), capable of treating a wide range of organic and inorganic wastes. In the two-stage thermal process, the fluidised bed gasifier (FBG) converts the waste to a crude syngas containing significant ...
PURPOSE: To obtain the plasma-process waste gas purifying device with the contact efficiency between the plasma and waste gas increased and capable of being scaled up by arranging a wire-type discharge electrode at the center of a honeycomb couter electrode consisting of a polygonal-sectioned prism...
To overcome the problem of the poor machinability of RS-SiC in conventional machining, the application of atmospheric-pressure plasma chemical vaporization machining (AP-PCVM) to RS-SiC was proposed. As a highly efficient and damage-free figuring technique, AP-PCVM has been widely applied for ...
摘要: PURPOSE: To provide an exhaust gas purificating apparatus by a plasma process by which a problem of contacting efficiency between a plasma and an exhaust gas and a problem of scale-up are simultaneously solved.收藏 引用 批量引用 报错 分享 ...
However, the economic viability of Gas-to-Liquid processes today and in the future still depends on key factors such as low-cost gas, capital costs, site-specific conditions and possible synergy with other industrial activities, e.g. power generation. The SMDS process has developed into a ...
to interact with the process gas, the electromagnetic field is controlled to have an energy level which varies cyclically between at least two values each sufficient to maintain the plasma, such that each energy level value is associated with performance of a respectively different treatment process ...
GAS plasmagene consists of a ternary mixture of helium, argon and hydrogen and containing at least 10% hydrogen APPROXIMATELY, typically 30 to 70% helium, 10 to 50% argon and from 10 to 25% HYDROGEN, preferably 20% ((MAS LESS) 5%) HYDROGEN. APPLICATION plasma spraying metal powder.收藏...
Disclosed is a process for etching a film of boron nitride with high selectivity to a layer of silicon dioxide or silicon nitride. The process involves exposing the film to a plasma formed from a mixture of an oxygen-containing gas, such as oxygen, and a small amount of a fluorine-containi...
Results of this study indicated that conventional SNCR process could be operated at a much lower temperature by applying plasma technology to generate NHi radicals. 展开 关键词: Plama dielectric barrier discharge NO_x removal selective reduction ...
The process described uses a low oxygen gas or non-oxygen gas plasma that removes the photoresist and provides a protective surface layer over the low-k dielectric material. The low-k dielectric material is part of a dielectric stack. After exposure to the gas plasmas the integrated circuit is...