The printed circuit board thermal pad must be connected to the ground net and thermal vias to any existing backside/internal copper ground planes. Connection to a ground plane on the top layer near the corners of the device is also recommended. Another key layout consideration is to keep the ...
namely in an acceptance region for the internal supply stack 23/1; the structure and function of this means 28 shall be explained later, the recording medium that has already been printed on the front side being turned over thereover for printing the backside thereof and being resupplied to ...