热膨胀系数(Thermal Expansion Coefficient)是指物质在受热后单位温度变化下的长度或体积扩展率。简单来说,它描述了物质受热或冷却过程中的尺寸变化程度。fr4是一种常用的高强度、高温耐受的玻璃纤维增强热固性环氧树脂板,具有很高的机械性能和电性能,被广泛应用于PCB板、通信设备和航空航天等领域。那么,fr4的热膨胀系数...
温度系数(Coefficient of Thermal Expansion, CTE):FR4的CTE一般在(55-60)ppm/C,适合与其他材料(如铜)相结合,减少因热膨胀造成的应力和变形。 这些电气性能指标使得FR4超长板在高频、高速和高密度的电子应用中具备较好的表现,并且广泛应用于通信、汽车电子和消费电子等领域。
环氧玻璃布层压板主要性能指标mainpropertyindicationmethodindicatiphysicalpropertiesgbt5130玻璃纤维含量glassfibrecontent吸水性10mmwaterobsorptionmggbt513034热膨胀系数thermalexpansioncoefficientgbt103611110导热系数coefficientheatconductivitymechanicalproperties垂直层向弯曲强度flexuralstrengthatperpendicularlamination常态23undernormal...
since FR4 boards have lower thermal conductivity than glass epoxy boards, their operating temperatures are also lower than those of glass epoxy boards; therefore, they are
4.Thermal Performance: Check the decomposition temperature and the coefficient of thermal expansion. Materials with higher decomposition temperatures and lower thermal expansion are preferable for applications that undergo significant thermal cycling.
Thermal Expansion Coefficient 1/℃ GB/T1036 11.1×10 5 导热系数 Coefficient of Heat Conductivity w/m.k —— 0.46 机械性能 Mechanical Properties 6 垂直层向 弯曲强度 Flexural Strengthat perpendicular to lamination 常态(23+2)℃ Under normal MPa GB/T5130 ≥410 热态(150+5)℃ At heat MPa ≥24...
The difference between the thermal expansion coefficient and the shape of FR-4 causes the white line. A substrate whose thickness is greater than 0.2 mm and width is smaller than 10 mm may cause this phenomenon. Different reasons can cause it, and we use different methods to eliminate these ...
环氧玻璃布层压板主要性能指标mainpropertyindicationunit试验方methodindicatiphysicalproperties密度densitygcmgbt5130玻璃纤维含量glassfibrecontent吸水性10mmwaterobsorptionmggbt513034热膨胀系数thermalexpansioncoefficientgbt103611110导热系数coefficientmechanicalproperties垂直层向弯曲强度flexuralstrengthatperpendiculalamination常态23...
l Better Thermal Stability – Withstand high temperatures without deformation. l Lower Coefficient of Thermal Expansion (CTE) – Reduces stress on components and solder joints. l Improved Mechanical Strength – Ensures dimensional stability under thermal cycling. ...
Coefficient of Thermal Expansion-CWISO 11359m/K/ Thermal ConductivityISO 11359W/(m·K)2.2~2.5 FlammabilityUL 94ClassV-1 II.Mechanical Properties Tensile strength at yieldISO 527-2MPa≥220 Tensile strength at breakISO 527-2Mpa/ Hardness RockwellDIN 53505120-125 ...