The HSC-ADC-EVALCZ high speed converter evaluation platform uses an FPGA based buffer memory board to capture blocks of digital data from the Analog Devices high speed analog-to-digital converter (ADC) evaluation boards. The board is connected to the PC through a USB port and is used with Vi...
关键词：无线通信同步采集高速ADC Design and Implementation of a High－speed ADC Synchronous Acquisition Circuit Based on FPGA Qin Yanzhao Ming Lei Zhuang Dongshu Abstract In the field of wireless communication，the signal bandwidth of real－time analysis and pro-cessing is getting larger，which ...
.CLK(W_dc_clk), // 1-bit input: High-speed clock .CLKB(~W_dc_clk), // 1-bit input: High-speed secondary clock .CLKDIV(W_fc_clk), // 1-bit input: Divided clock .OCLK(1’b0), // 1-bit input: High speed output clock used when INTERFACE_TYPE=“MEMORY” .DYNCLKDIVSEL(1...
The HSC-ADC-EVALCZ high speed converter evaluation platform uses an FPGA based buffer memory board to capture blocks of digital data from the Analog Devices high speed analog-to-digital converter (ADC) evaluation boards. The board is connected to the PC through a USB port and is used with Vi...
ADC的性能测试通常有两种方法,一种是通过仪器设备进行测试,将ADC采集到的数字信号送给高精度数模转换器(简称DAC)进行信号重建,通过模拟测试仪器测试DAC输出的模拟信号,通过公式可计算得到ADC的性能指标,但是此测试方法成本较高、精度较低且较为复杂。另一种是利用商业数据软件(MATLABE)或高速数据转换软件(High Speed ...
High-speed ADC combines with FPGA to enable single-slot SDR solutions0-10-20-30By Angsuman RudraAlexis Bose
Entire schematic circuit diagram which carries the high -speed A/D sampling and transformed and the data storage after the transforms is also given. Key words : FPGA ; ADC08200 ; FIFO ; VHDL 对A/D 转换器进行采样控制,传统方法一般是用 低、体积 小和 易于使 用等 优点 。 最高采 样频 ...
Key words :time-interleaved;FPGA;error correction;high-speed sampling 0 引言 随着高速数字通信技术的发展,传统的低速采样技术已难以满足宽带、超宽带雷达等领域对高速高精度数据采集的需求[1]。而且在航空、工业应用中对数据采集设备的采样率和精度要求也越来越高,高速ADC数据采集系统的应用需求越来越广泛。虽然现有...
HSC-ADC-EVALCZ评估平台主要特性: Xilinx Virtex-4 FPGA-based buffer memory board Used for capturing digital data from high speed ADC evaluation boards to simplify evaluation 64 kB FIFO depth Parallel input at 644 MSPS SDR and 800 MSPS DDR Supports 1.8 V, 2.5 V, and 3.3 V CMOS and LVDS inte...
在模式1和模式2中,FPGA分别连接到DSP1和DSP2,并将通用计算核心卸载到DSP上面。这些通用核心包括在神经网络(NN)和通信工作负载中至关重要的矩阵乘法(MMM)和二维卷积(conv)。在模式3中,DSP1和DSP2被组合起来以增强计算能力。DSP2也可以被FE芯粒(例如光学tile或 ADC tile)取代,以实现完整的通信或传感系统。