ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (+/-1.0 µm), with multi-chip capability, a modular machine concept and much more! Inside Photonics ISO Certificate English ISO Certificate German The Nova PlusDie Bonder / Flip Chip Bonder has a wide range of features in...
this type of die bonding can be classified asthermocompression BondingorTCB. And in other cases these capabilities are also required forthrough silicon viaorTSV. As a larger category ofAdvanced Packaging Die Attach, the AFCPlus is considered one of the most flexibleDie Bonderson the market today...