A process is disclosed for high density indium bumping of microchips by using an innovative template wafer upon which the bumps are initially fabricated. Once fabricated, these bumps are transferred to the microchip, after which can be hybridized to another microchip. Such a template wafer is ...
Also feel free to add your own alternatives/improvments For non-dev advanced users Read this README entirely Clone the repo Download the data with the link provided below Play with it Check issues with the 'advuser' tag Also go to the 'faceswap-playground' repo and help others. For end-...
The FlipFlopWax template has the appropriate clearances for tools and shanks where required, counterbores and chamfers around seating/interfacing edges, radii and slopes to allow access, and orientation markings to assist you remounting the ring correctly. Any roughing of the template and spigot can...