Fan-Out Wafer-Level Packaging John H. Lau 3971 Accesses 5 Citations Abstract In this chapter, a flip chip is defined (Lau in Flip Chip Technologies. McGraw-Hill, New York, 1996 [1]; Lau in Low Cost Flip Chip Technologies. McGraw-Hill, New York, 2000 [2]; Lau et al. in ...
materials (e.g., Sn鈥揚b, Cu, Au, Ag, Ni, In, and isotropic or anisotropic conductive adhesives) and methods [e.g., mass reflow and thermocompression bonding (TCB)], as long as the chip surface (active area or I/O side) is facing the substrate or another chip as shown in Fig....
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Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds...
Fan-out wafer-level packaging (FOWLP) has garnered much attention lately as a cost-effective way... W Qi,L Xiao,K Han,... - Electronic Components & Technology Conference 被引量: 0发表: 2017年 Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs...
A flip-chip package includes a package carrier; a semiconductor die having a die face and a die edge, the semiconductor die being assembled face-down to a chip side of the package carrier, and contact pads are situated on the die face; a rewiring laminate structure between the semiconductor...
Fan, L., et al. (2002). "Adhesion of underfill and components in flip chip encapsulation", Journal of Adhesion Science & Technology 16(2): 213-223.Fan, L., Moon, K.S. and Wong, C.P., "Adhesion of underfill and components in flip chip encapsulation", J. Adhesion Sci. Technol.,...
flip-chip flip-chip 中文:倒装法 flip chip 中文:倒装芯片
求翻译:flip chip是什么意思?待解决 悬赏分:1 - 离问题结束还有 flip chip问题补充:匿名 2013-05-23 12:21:38 倒装片 匿名 2013-05-23 12:23:18 倒装晶片 匿名 2013-05-23 12:24:58 倒装晶片 匿名 2013-05-23 12:26:38 倒装芯片 匿名 2013-05-23 12:28:18 冒失的芯片...