14nm metal gate film stack development and challenges 14纳米金属栅的发展与挑战.pdf,14NM METAL GATE FILM STACK DEVELOPMENT AND CHALLENGES ] ] Jianhua Xu *, Anni Wani, Jun Hi, Xuezhen Jing , Ziying zhani, Beichao Zhani 2016-09-26 1. Semiconductor Manufactu
1) film stack 薄膜叠存储器2) thin-film storage 薄膜存储器3) film memory 胶片存储器;薄膜存储器4) cryogenic film 低温薄膜存储器5) associative film memory 相联薄膜存储器6) thin magnetic film memory 磁性薄膜存储器补充资料:随机存取存储器(见半导体存储器) 随机存取存储器(见半导体存储器) ...
6) film stack 薄膜叠存储器补充资料:随机存取存储器(见半导体存储器) 随机存取存储器(见半导体存储器) random access memory,RAM s日1}}Cunq日Ct旧choql随机存取存储器random aeeess memoryRAM)见半导体存储器。 说明:补充资料仅用于学习参考,请勿用于其它任何用途。
film over wire (FOW); stack-die CSP (Chip Scale Package); 机译:金属丝薄膜(FOW);堆叠芯片CSP(芯片级封装); 入库时间 2022-08-26 13:47:38 相似文献 外文文献 中文文献 专利 1. Backside Metallization of Ag-Sn-Ag Multilayer Thin Films and Die Attach f...
The tape is laminated onto a carrier wafer and the device wafer is bonded onto this stack enabling a "pyramid"-like structure. With this technology ... S Pargfrieder,P Lindner,G Mittendorfer,... - International Commercialization of Micro & Nano Systems Conference: International Commercialization ...
High-quality crack-free GaN films have been grown on 2-inch diameter Si(111) substrate using AlN/GaN/AlN stack structure by metalorganic chemical vapor dep... Kang Jea Lee,Eun Ho Shin,Sang Kyun Shim,... - Physica Status Solidi. C, Conferences and critical reviews 被引量: 0发表: 2005...
4) high reflectivity film stack 高反膜系 5) high contrast 高反差 1. The preparation conditions,practical properties and some problems relating its application of silver halide dry plate ofhigh contrastfor holography are described. 本文研究了全息照相用高反差银盐干版的制备条件和使用性能,并就其应用方面...
separation medium (混凝土下的塑料薄膜垫底) 隔离介质 graphic arts technique (厚膜电路制造工艺) 图形法 safety member (原子堆) 事故棒 manual scram (反应堆) 手动紧急停堆 exponential assembly (反应堆的) 指数装置 heat exchanger lag (反应堆) 热交换器延迟 graphite stack (反应堆中的) 石墨堆 ...
aflue gas exhaust stack 废气尾气堆[translate] a他要和他的朋友一起去。 He wants to go together with his friend.[translate] a据估计明年夏天中国许多地区将严重缺电 According to estimate in the summer Chinese many areas will be next year serious lack the electricity[translate] ...
damage cause the product fail in the stack die chip on die bond process, but this film is easy to occur film burr issue during wafer dicing saw ... TJ Su,YF Chen,JC Cheng,... - 《International Journal of Modeling & Optimization》 被引量: 0发表: 2016年 Patent Issued for Bonding Fil...