exposed pad area! 青云英语翻译 请在下面的文本框内输入文字,然后点击开始翻译按钮进行翻译,如果您看不到结果,请重新翻译! 翻译结果1翻译结果2翻译结果3翻译结果4翻译结果5 翻译结果1复制译文编辑译文朗读译文返回顶部 裸露焊盘面积! 翻译结果2复制译文编辑译文朗读译文返回顶部...
求翻译:exposed pad area!是什么意思?待解决 悬赏分:1 - 离问题结束还有 exposed pad area!问题补充:匿名 2013-05-23 12:21:38 裸露焊盘面积! 匿名 2013-05-23 12:23:18 被暴露的垫区域! 匿名 2013-05-23 12:24:58 被暴露的垫区域! 匿名 2013-05-23 12:26:38 曝光垫区域 ! 匿名 ...
aDiluting air heat element Solid 稀释的空气热元素固体[translate] alipid peroxidation 油脂过氧化[translate] aVoltage distribution terminal strip 电压发行接线条[translate] ado you like this 做您喜欢此[translate] asolder at >80% of exposed pad area 焊剂在>80%被暴露的垫区域[translate]...
Is there a standard for the contact area of the exposed PAD of MAXV QFP64 with the printed circuit board?For example, 50% or more. Thank you for your support. <Previous questiom> https://community.intel.com/t5/Programmable-Devices/MAX-V-Exposed-pad-solder-reflow-problem/...
Is there a standard for the contact area of the exposed PAD of MAXV QFP64 with the printed circuit board?For example, 50% or more. Thank you for your support. <Previous questiom> https://community.intel.com/t5/Programmable-Devices/MAX-V-Exposed-pad-solder-reflow-problem/m-p/164607...
The overall solder coverage (i.e., the ratio of solder area to exposed-pad area, here expressed as a percentage) can be controlled by adjusting the geometry of the matrix—assuming that you know what the overall coverage should be. You’re not likely to figure out the “ideal” ratio, ...
Bonding pad with circular exposed area and method thereofLiHsin Chang
Labels are required to be applied on or adjacent to the area where the hazard is present. Labels are required to be permanently affixed to the equipment. Ensure that the surface to which the label(s) will be applied on is clean and free of dirt, dust, grease and moisture. If the surfa...
If the exposed pad is intended to provide significant power dissipation, the PCB designer should add vias from the exposed pad's land area to a copper polygon on the other side of the PCB. This lowers the thermal impedance from the IC to the ambient air. ...
If the exposed pad is intended to provide significant power dissipation, the PCB designer should add vias from the exposed pad's land area to a copper polygon on the other side of the PCB. This lowers the thermal impedance from the IC to the ambient air. ...