PROBLEM TO BE SOLVED: To provide an etching solution with high stability, which foams less at the time of use and which can highly selectively perform the etching of copper or copper alloy, in a process of etching copper or copper alloy from an electronic substrate having a layer comprising ...
which can etch copper films quickly and uniformly without increasing the rate of side etching by consisting the same of an aq. (NH4)2S2O8 soln. added with NH4Cl. CONSTITUTION:An etching soln. for copper prepd. by adding NH4Cl at <=10g/l rate to an aq. ammonium persulfate[(NH4)2S2O8]...
An etching solution for copper or copper alloys comprising, (a) sulfuric acid, (b) a persulfate, (c) at least one compound selected from imidazole, imidazole derivatives, pyridine derivatives, triazine, and triazine derivatives, and (d) water. The etching solution exhibits a high etching speed...
SOLUTION FOR ETCHING COPPER SURFACES AND METHOD OF DEPOSITING METAL ON COPPER SURFACES 一种用于蚀刻铜或铜合金的溶液,其可用于制备具有尽可能亮的铜表面以供随后金属镀敷之用. A solution for etching copper or copper alloy, which can be used for preparing a copper surface as bright for subsequent me...
property, and can greatly reduce the surface tension of the solution, such that the etching solution consumption is less, and the production cost is low... 白航空 被引量: 0发表: 2017年 ETCHING SOLUTION FOR COPPER OR A COMPOUND COMPRISED MAINLY OF COPPER The present invention relates to an ...
PURPOSE:To extend the life of the title etching solution to treatment quantity by constituting the etching solution of an aqueous solution respectively containing a specific amount of ammonium persulfate and a specific amount of alkali metal chloride. CONSTITUTION:A copper etching solution is composed ...
Solution for the etching of copper or a copper alloy, which, a ph - value in the range from 4 and low, and sulfate ions in a concentration of less than 0,2 w -%, further comprising:a) at least one oxidizing agent selected from a group comprising hydrogen peroxide and peracids,b) ...
etching solution for copper content 130g / L-150g / L, pH adjusted to 2.0 to 3.0, by adding aluminum 60 ~ 80g / L reactor, a temperature of 75-85 ℃, air was passed through the reaction process, the reaction is precipitated as electronic grade copper powder, the solution is polyalumi...
An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least on... F Michalik,N Lützow,J Gaida,... 被引量: 0发表: 2020年 Copper and copper alloy micro-etching agent 一种由含有二价铜离子源,酸...
After removal of the copper surface, the etching solution is passed for regeneration of the oxidizing agent through an electrolysis cell having an anode and a cathode, with copper being deposited on the cathode. The etching solution is maintained free of chloride ions and contains as the ...