volume 2. number 1 chemical physics letters measurement of the thermal conductivity of argon using hot-wire type thermal diffusioet columns 来自 dx.doi.org 喜欢 0 阅读量: 12 作者:VK Swena,P Departmenf,R Universiiy,SC %Xena DOI: 10.1016/0009-2614(68)80144-7 ...
A packaged semiconductor device includes a leadframe including a finger pad(s) that is integrated, and spans a finger pad area including a width narrower than its length. A first portion of the finger pad area provides a die support area. A second portion of the finger pad area provides a...