摘要: Simple equations are developed for predicting thermal constriction/spreading resistances associated with heat transfer in electronics packaging applications.关键词: constriction resistance spreading resistance 会议名称: 1994 international electronics packaging conference ...
Au. Closed-form equation for thermal constriction/spreading resistances with variable resistance boundary condition. In Proc. Int. Electronics Packaging Conf., pages 111-121, May 1994.Song S,Lee S,Au V.Closed form equation for thermal constriction/ spreading resistances with variab...
Note that this is directly analogous to what happens with current in electrical conduction. In electrical conduction, the current is equal to the voltage divided by the electrical resistance. Electrical conductivity and electrical current are analogous to thermal conductivity and current, voltage is anal...
aAs it was mentioned in Section 2 that during pre-conditioning period the hot water was flown through the collector pipe to achieve a certain uniform initial high temperature of the absorber plate and pipe, therefore, for negligible thermal resistance of the bond between the absorber pipe and pla...
Consistent with the Callaway collision operator for the bulk phonon dynamics, the interface phonon collision process is regarded as a linear relaxation mechanism toward the local pseudo-equilibrium phonon distribution uniquely defined by the energy conservation principle. The interface thermal resistance is...
Simple equations are developed for predicting thermal associated with heat transfer in electronics packaging applications. KEYWORDS constriction resistance, spreading resistance Resistances constriction/spreading resistances INTRODUCTION Whenever heat flows through one or more solids involving a change in cross-sect...
The thermal resistance problem for a medium with two circular inclusions is reduced to a system of functional–differential equations in a class of analytic functions. It is proved that the operator corresponding to the functional-differential equations is compact in the Hardy space. Moreover, these...
Higher heat capacities thus imply a greater resistance to temperature change for a given mass of a substance, and more mass by itself means a higher heat capacity. This makes intuitive sense; if you exposed 10 mL of water to "high" in a microwave for one minute, the temperature change wil...
Driven by miniaturization and increasing power dissipation there is a strong need for better cooling of electronic components on printed circuit boards (PCB). One major contributor to the thermal resistance is the PCB itself. In IPC-7093 several thermal via configurations are discussed which enable ...
sLaw:dTq=-kA,Ifthetemperaturegradientisaconstantdxq=constent(heattransferrateisaconstant)dTT2T1,whereT(x0)T1,T(xL)T2dxL T1T2 T1T2T1T2dTqkAkAdxL(L/kA)T1T2Lq,whereR:thermalresistanceRkA q(I)T1(V1)T2(V2)Electriccircuitanalogy xL ...