Epoxy resin composition for semiconductor encapsulation, mold release agent and semiconductor device(A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and then a release agent, wherein the release agent epoxy resin composition used for semiconductor encapsulation is, (D) having a...
Resin For Beginners|Create Keychain|Versatile Silicone Mold Kit:Includes 5 geometric shapes, perfect for creating unique epoxy resin jewelry. Easy-to-Use Mold Release Agent:Comes with mold release agent for smooth demolding of resin crafts. Multi-Shape Mold Variety:Features round, square, oval, wa...
Silicone Mold Release Agent Fo Polyurethane Moldings with Shiny and Smooth Feel Performance US$7.00-9.00 / kg General Use Silicone Resin Mold Release Agent Fo Polyurethane Materials US$7.00-9.00 / kg High Concentration Silicone Mold Release Agent for Polyurethane Moldings Negotiable 10000cst...
Pull the item out of the mold Note: Contamination from sulfur (e.g., sulfur-based clay), amines, tin compounds, cured polyester resin, some paints and some silicone rubbers may inhibit surface cure of platinum-cured rubbers. Apply a release agent, Although not usually ...
PURPOSE: To provide an epoxy resin molding material for sealing which contains a polyolefin wax as a mold release agent, and is suitably used in sealing for electric parts, electronic parts, semiconductor elements because of its excellent lead adhesion and mold release properties. ;CONSTITUTION: (...
Epoxy resin 8086A/B The raw materials used in 8086A/B double-group liquid unfilled epoxy resin are imported Shell bisphenol A resin and methyl hexahydroacid anhydride curing agent, which are processed and reacted by a special process. The product has advanced technological performance and good ...
PURPOSE:To obtain an epoxy resin mold material having excellent durability, tear strength, tensile strength and releasability and suitable for the production of a simple-type mold by compounding a urethane-modified epoxy resin, an amine hardener and an internal mold-release agent at specific ratios...
6810 is a solvent-free mold release agent for mold release. Mainly used for mold release of dry-type transformers. Release agent 6810 7025A/B-1 environmental protection series of room temperature curing epoxy resin coatings can be applied by binding between the discus of the reactor. Excellent...
摘要：PURPOSE:To obtain the title material excellent in thermal conductivity and reliability of moisture resistance, by mixing an epoxy resin with specified Si3N4 and optionally a crosslinking agent, a cure accelerator, a curing agent, a mold release, a colorant, a coupling agent, etc. ...
:To prepare an epoxy resin composition giving a cured product having improved stain resistance and anti-adhesive properties at high temperatures and useful as a mold release agent for plastics and rubbers, by compounding an epoxy resin with an precondensate of an amino resin as a curing agent. ...