Board assemblies, modules, packages, full wafers, wafer coupons, die FOV Max 200 mm x 160 mm; min 0.62 mm x 0.51 mm DUT stimulation Internal DC power supply; ATE, CA bus, boundary scan tester, system level tester Up to 10 kV capable (requires VX option) Time to results Min...
Board assemblies, modules, packages, full wafers, wafer coupons, die FOV Max 200 mm x 160 mm; min 0.62 mm x 0.51 mm DUT stimulation Internal DC power supply; ATE, CA bus, boundary scan tester, system level tester Up to 10 kV capable (requires VX option) Time to results Min...
Lateral resolution Down to 1 μm Depth resolution Down to 20 μm Defect types Wide range of shorts (2 mΩ to 2 GΩ), leakage (power dissipation as low as 1 μW), resistive opens Sample types Board assemblies, modules, packages, full wafers, wafer coupons, die ...
Irrespective of the type of equipment used, the pins/coupons were tested against a pearlitic grey cast iron counterface in the form of discs. In the case of the pin-on-disc, the diameter and thickness of the discs were 60 mm and 6 mm, respectively. On the other hand, for the subscale...