Disclosed are methods of fabricating an integrated computational element for use in an optical computing device. One method includes providing a substrate that has a first surface and a second surface substantially opposite the first surface, depositing multiple optical thin films on the first and ...
INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR This application provides an integrated circuit device and a preparation method thereof, and relates to the field of semiconductor technologies. An isolation section for suppressing a leakage current path of two adjacent transistors may ......
The main aim of this paper is: (1) to ... D Tang,W Eversheim,G Schuh,... - 《International Journal of Computer Integrated Manufacturing》 被引量: 29发表: 2004年 Laser welding technology for joining different sheet metals in a one-piece stamping process A technique was developed of ...
Process for manufacturing integrated resistive elements with silicidation protectionIn a process for the fabrication of integrated resistive elements with protection from silicidation, at least one active area () is delimited in a semiconductor wafer (). At least one resistive region () having a ...
aDescriptions of engineering objects such as elements and structures of products,results of tests and analyses,and engineering processes for design,analysis,and manufacturing of products have developed into very complex integrated data structures. 正在翻译,请等待...[translate]...
A method is presented for obtaining fast coordinated control of robot and manipulator arms which have transmission elements with significant flexibility. T... JR Hewitt - 《Robotics & Computer Integrated Manufacturing》 被引量: 5发表: 1989年 Three Gripping of different types of objects with a multi...
DESIGN SUPPORT DEVICE FOR SEMICONDUCTOR INTEGRATED CIRCUIT, COUNTERMEASURE METHOD FOR UNNECESSARY RADIATION OF SEMICONDUCTOR INTEGRATED CIRCUIT, AND COMPUTER PROGRAM PROBLEM TO BE SOLVED: To provide a design support tool useful for verifying EMC characteristics.SOLUTION: A countermeasure method for unnecessary...
Impact of Water Adsorption on Nonlinear Optical Properties of Functionalized Porous Silicon. Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV).
Gu, Z. G. Bao, A cooperative process-management system based on the manufacturing grid, International Journal of Computer Integrated Manufacturing,20,2.244–253,2007. [4]B. Jiang, Research on design method of parts based on manufacturing features, Harbin Engi-neering University, 2001. [5]B. ...
An integrated, computer-assisted process planner for the machining of moulds for expanded polystyrene foam Styrofoam materials have been used for some time as packaging for consumer goods to protect against damage during transportation and handling. The moulds f... S Lye,S Lee,H Yeong - 《Integr...