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and vibration board was created using the Inventor 2018 software (Autodesk, San Francisco, CA, USA), saved as a .stl file, and then imported into the EDEM 2020 software (DEM Solution, Edinburgh, UK) for simulation modeling. In order to apply vibration to soil particles, sinusoidal translatio...
The Edinburgh Elasto-Plastic Adhesive (EEPA) model is selected in this paper to describe the contact between seed and soil particles. The significance of the input parameters in the EEPA model is investigated using the Plackett–Burman test. The parameters between soil and seed particles are ...
some scholars have also built multi-sphere models of soil particles. The size of the particle model is determined according to the simulation needs. The main contact models used in analyzing soil particles include the parallel bonding model, the Edinburgh model, the HM+JKR model, etc. The main...