The 2022 5th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2022) serves as good platforms for academics, researchers, and engineers to meet and exchange innovative ideas and information on all aspects of Advanced Electronic Materials, Computers and So...
Electronic Materials and Applications 2022 (EMA 2022) is an international conference focused on electroceramic materials and their applications in electronic, electrochemical, electromechanical, magnetic, dielectric, biological, and optical components, devices, and systems. Jointly programmed by the Electronics...
Electronic Materials Conference ProceedingsNo Abstract available for this article.doi:10.1007/BF02811578Springer-VerlagMetallurgical & Materials Transactions B
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists: 徐老师 +86-17780680378(微信同号) 1347638002 -- +86---(微信同号) -- Important Dates | 重要日期 Submission Deadline: 2024.12.26 Registration Deadline: 2024.12.31...
Conference on Electronic and Advanced Materials Dates: TBD Venue: TBD, TBD, United StatesElectronic Materials and Applications addresses emerging needs, opportunities and key challenges in the field of electronic materials and applications. Technical presentations highlight advancements in materials and devi...
《电子材料学报》(Journal Of Electronic Materials)是一本以工程技术-材料科学:综合综合研究为特色的国际期刊。该刊由Springer US出版商创刊于1972年,刊期Monthly。该刊已被国际重要权威数据库SCIE收录。期刊聚焦工程技术-材料科学:综合领域的重点研究和前沿进展,及时
19th International Conference on II-VI Compounds and Related Materials ISSN: 0361-5235 (Print) 1543-186X (Online) In this topical collection (21 articles) Page of 2 Topical Collection: 19th International Conference on II-VI Compounds The Properties of Cd1−xZnxTe Films Prepared by RF Magn...
Topic 1: Electronic Technology 3D process and integration technology Substrate embedding and advanced flip chip packaging MEMS and sensor technology Wafer-level CSP and heterogeneous integration Design and Analysis of Transmission System New materials, equipment and 3D interconnection Wearable, flexible and ...
The present conference on the advancement of electronic materials encompasses the processes and materials for EMI shielding, surface-mount technology, dielectric materials, radomes, electronic adhesives, superconductor materials, photonics and conductive polymers, packaging for severe environments, and rigid fl...
The 2025 International Conference on Materials Engineering, Advanced Electronic Materials and Information Engineering (MEAIE 2025) is scheduled to be held in Nanchang, China. The conference will focus on research areas such as materials engineering, advanced electronic materials and information engineering....