24. A method for fabricating an electronic component, the method comprising: providing an electrically conductive carrier comprising a first carrier surface; providing at least two spacers between a chip surface and the first carrier surface; attaching a chip to the carrier so that the chip surface...
Spacer elements are embedded in the joining material. Between the spacers and the surface of the device and between the spacers and the surface of the electronic component connections are arranged.THOMAS BEMMERLJOACHIM MAHLER
Push-pull -conjugated systems of the thiophene type have several interesting applications as nonlinear optical (NLO) and photochromic materials, sensitizer... Sara S. M. Fernandes,M. Raposo 被引量: 0发表: 2016年 Spacer Twisting Strategy to Realize Ultrabright Near-Infrared II Polymer Nanoparticles ...
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This story of future electronic component materials begins in the distant past. Consider the Stone Age that lasted for millions of years, when mankind was limited to tools made of, well, stone. Just a few thousand years ago, the Bronze...
These molecular components were electrografted onto several different electrode materials to construct the molecular electronic devices. Glassy carbon (GC) plates and rods provided an ideal substrate for most studies due to their electrical conductivity, wide potential window, and low surface roughness. ...
there is always be a viscoplastic–elastic adaptation on the first few cycles before the stretchable interconnects achieve a consistent mechanical response. Optimizations in serpentine design, materials choice, and substrate thickness can be performed to improve the durability of this type of stretchable ...
Integration of GO into photovoltaic devices, such as organic solar cells, dye-sensitized solar cells (DSSCs), and perovskite solar cells (PSCs), could lead to significant improvements in efficiency, stability, and scalability. Additionally, GO-based materials can serve as versatile components in ...
<div p-id="p-0001">An electronic component and a method for fabricating the electronic component are provided. The electronic component includes a carrier, a first metal layer, a dielectric layer, a s
10. An electronic component comprising: an element substrate; and a lead electrically connected to the element substrate, wherein the logic circuit according to claim 3 is provided for the element substrate. 11. An electronic device comprising: the logic circuit according to claim 1; and at leas...