CONSTITUTION:A highly alkaline electroless Cu plating soln. contg. cyanogen is sampled and cyanogen analyzing reagents (Cu ions and phenolphthalein, p-nitrobenzaldehyde or o-dinitrobenzene) developing a color in a highly alkaline region are added to the sampled plating soln. The absorbance of the ...
Electroless copper plating process of N, N, N, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate.pdf 2015-02-14上传 Electroless copper plating process of N, N, N, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate ...
processparametersforelectrolesscopperplatingareobtainedfinally. Keywords:carbonfiber;composite;metallization;electrolesscopperplating 引言镀 : a)先在非金属材料制件表面化学沉积金属,再电 碳纤维复合材料具有重量轻、热膨胀系数低等优 点,具有良好的成型方法,成型后进行金属化镀覆,实 现电气功能,可替代金属制件实现其...
This invention provides a process for electroless copper plating without using formaldehyde and an electroless copper plating solution which is used in the process. To this end, there is disclosed a process for electroless copper plating, which treatment comprises depositing a palladium or palladium-ti...
2) electroless copper 化学镀铜 1. The disadvantages of common electroless copper plating process were pointed out. 通过对铜原子结构的分析,提出了得到良好结合力的化学镀铜层的可能性,进而给出了使用"考本"液在钢铁上直接化学镀铜的工艺。 更多例句>> ...
镀铜/化学镀铜2) electroless copper 化学镀铜 1. The disadvantages of common electroless copper plating process were pointed out. 通过对铜原子结构的分析,提出了得到良好结合力的化学镀铜层的可能性,进而给出了使用"考本"液在钢铁上直接化学镀铜的工艺。 更多例句>> ...
摘要: By means of constant control of the temperature between 70 DEG and about 80 DEG C. and control of the cyanide ion concentration between 0.0002 and 0.0004 molar, high quality electroless copper plating processes are carried out from solutions containing cupric ions....
ELECTROLESS COPPER PLATING 专利名称：ELECTROLESS COPPER PLATING 发明人：FREDERICK W. SCHNEBLE JR.,RUDOLPH J.ZEBLISKY,JOHN F. MCCORMACK,JOHN DUFF WILLIAMSON 申请号：US3650777D 申请日：19710211 公开号：US3650777A 公开日：19720321 专利内容由知识产权出版社提供 摘要：An improved aqueous autocatalytic ...
An aqueous alkaline copper plating solution comprises e.g 0.002 to 0.15 moles of a water soluble copper salt; 0.03 to 1.3 moles of formaldehyde; 0.7 to 2.5 times the moles of copper of nitrilotriacetic acid or its salts; 0.00001 to 0.06 moles of a cuprous complexing agent; alkali metal hydr...
申请(专利)号: US08/717195 申请日期: 19960918 公开/公告号: US05849355A 公开/公告日期: 19981215 申请(专利权)人: ALLIEDSIGNAL INC. 发明人: MR Mchenry 摘要: An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.收藏...