Dynamic electrical properties of polymer-carbon nanotube composites: Enhancement through covalent bonding We have prepared a composite from polystyrene and multi-walled carbon nanotubes (MWCNT) and, unlike traditional techniques of composite formation, we chose ... Curran,SA,Zhang,... - 《Journal of ...
Treeing phenomena has been analyzed and interpreted by a physical model to explain the behavior in nanocomposites. The nature of bonding at the interface between epoxy and nano filler is characterized by using FTIR spectrometry. It has been shown that the type of bonding at the interface has an...
BACKGROUND: Hydrogen bonding is very important in determining the properties of nylons. Introducing nanofillers that can form hydrogen bonds with amide gro... L Li,G Yang - 《Polymer International》 被引量: 17发表: 2009年 Flame retardancy and mechanical property of polypropylene/nylon nanocomposite...
In a few cases, a heterogeneous nucleation of modifier particles occurred at the fibre surface as a consequence of favoured fibre/particle interactions. This reduced the fibre/matrix bonding strength and led to adhesive failures at the fibre/matrix interface. In using dendritic hyperbranched polymer ...
Nanosilica reinforced epoxy floor coating composites: preparation and thermophysical characterization R. , and Yahya, M. Y. ,Mechanical and Electrical Properties of Electrically Conductive Nanocomposites of Epoxy/Polyaniline coated Halloysite Nanotubes, Digest... M Mohammad,A Nikje,MR Khanmohammadi,... ...
It is known that there is a very weak bonding between carbon nanotube (CNT) and pure copper matrix since copper is known to be naturally nonwetting with CNT. In this study, the titanium is applied as a matrix-alloying element and the CNT-reinforced coppertitanium (CuTi) alloy composites (...
Bonding material of aluminum and copper is useful material concerning lightening, and thermal andelectrical conductivity. 粘结材料的铝和铜是关于减轻了有用的材料, 和热和电导率. 互联网 Theelectrical conductivityof the composites is less sensitive to the graphitization degree apparent density. ...
Next, the 2D precursors are transfer-printed onto prestretched silicone elastomer substrates via selective bonding using silicone adhesives (Sil-poxy, Smooth-On). Releasing the prestrains self-organizes the 2D precursors into 3D skeletons with programmed geometries. Then, pouring encapsulation silicone ...
2g). In order to match the overall diameter of the printed fiber dm and control the width of the bonding area to 30 μm, the inter-fiber spacing s was set as 800 μm for the construction of a 2D structure with a smooth external surface. (Fig. 2h and Supplementary Fig. 16). ...
Electrical bonding, in contrast, refers to the process of joining two or more pieces of material together to create a path exhibiting low electrical impedance of some predetermined quality. The specification for electrical bonding necessarily includes details concerning characteristics such as surface prepa...