PROBLEM TO BE SOLVED: To miniaturize electronic equipment by realizing high density mounting and thin thickness in a semiconductor device having a stacking layer structure in which a plurality of semiconductor chips are stacked. SOLUTION: In this semiconductor device 31 to be flip-chip-bonded to a...
【#麦当劳下调配送费收取打包费#】12月2日,@麦当劳 宣布麦乐送将于12月9日启用新的收费模式。外送费定价由9元调整为6元,并根据餐品数量收取打包服务费(新的收费模式同样适用于团餐渠道)。值得注意的是,肯德基在今年2月宣布下调配送费,并酌情收取打包服务费,今年7月,星巴克也宣布下调配送费并收取打包费。 L大河...